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ORCIDG. Q. Zhang
G. Q. (Kouchi) Zhang – Guoqi Zhang
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- affiliation: Delft University of Technology, Delft, The Netherlands
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2020 – today
- 2024
[j87]Minzhen Wen, Mesfin S. Ibrahim
, Abdulmelik Husen Meda, Guoqi Zhang, Jiajie Fan:
In-Situ early anomaly detection and remaining useful lifetime prediction for high-power white LEDs with distance and entropy-based long short-term memory recurrent neural networks. Expert Syst. Appl. 238(Part B): 121832 (2024)- [j86]Mei Liu, Kun Liu, Puchen Zhu, G. Q. (Kouchi) Zhang, Xin Ma, Mingsheng Shang:
Data-Driven Remote Center of Cyclic Motion (RC$^{2}$M) Control for Redundant Robots With Rod-Shaped End-Effector. IEEE Trans. Ind. Informatics 20(4): 6772-6780 (2024) - [c17]Wenyu Peng, Xinling Yue, Willem D. van Driel, Guoqi Zhang, Sijun Du:
A 70-V Fully Integrated Dual-SSHC Rectifier for Triboelectric Energy Harvesting with Full-Digital Duty-Cycle-Based MPPT Achieving 598% Power Extraction Enhancement. CICC 2024: 1-2 - [c16]Wenyu Peng, Willem D. van Driel, Guoqi Zhang, Sijun Du:
An Efficient Rectifier Hybridizing Synchronized Electric Charge Extraction and Bias-Flipping for Triboelectric Energy Harvesting. ISCAS 2024: 1-5 - [c15]Varun Thukral, Chen He, Rebecca Chen, Letian Zhang, Romuald Roucou, Michiel van Soestbergen, Jeroen J. M. Zaal, Rene Rongen, Willem D. van Driel, G. Q. Zhang:
AI-Enabled Board Level Vibration Testing: Unveiling The Physics of Degradation. ITC 2024: 436-444 - 2023
- [j85]Guoqi Zhang, Long Jin, Shuai Li:
Ball-Spin Control and Vibration Reduction Methods for Three-Wheel Pitching Device of Tennis Training Robot. J. Intell. Robotic Syst. 107(2): 30 (2023) - [j84]Long Jin, Guoqi Zhang, Yang Wang, Shuai Li:
RNN-Based Quadratic Programming Scheme for Tennis-Training Robots With Flexible Capabilities. IEEE Trans. Syst. Man Cybern. Syst. 53(2): 838-847 (2023) - [c14]Yunfan Niu, Jiarui Mo, Alexander May, Mathias Rommel, Chiara Rossi, Joost Romijn, Guoqi Zhang, Sten Vollebregt:
Design and Characterization of a Data Converter in a SiC CMOS Technology for Harsh Environment Sensing Applications. SENSORS 2023: 1-4 - 2022
- [j83]Pengfei Cheng, Xiaohan Cao, Yusheng Yang, Guoqi Zhang, Yongyi He:
Automatically recognize and segment morphological features of the 3D vertebra based on topological data analysis. Comput. Biol. Medicine 149: 106031 (2022) - [j82]Tianfeng Wang, Jianfei Dong, Guoqi Zhang:
Analyzing Efficacy and Safety of Anti-Fungal Blue Light Therapy via Kernel-Based Modeling the Reactive Oxygen Species Induced by Light. IEEE Trans. Biomed. Eng. 69(8): 2433-2442 (2022) - [j81]Tianfeng Wang, Jianfei Dong, Guoqi Zhang:
Analysis and Data-Based Modeling of the Photochemical Reaction Dynamics of the Induced Singlet Oxygen in Light Therapies. IEEE Trans. Biomed. Eng. 69(11): 3427-3437 (2022) - [c13]Leiming Du, Xiujuan Zhao, Piet Watté, René Poelma, Willem D. van Driel, Guoqi Zhang:
Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects. IECON 2022: 1-5 - [c12]Hendrik Joost Van Ginkel, Mattia Orvietani, Joost Romijn, Guoqi Zhang, Sten Vollebregt:
ZnO Nanoparticle Printing for UV Sensor Fabrication. IEEE SENSORS 2022: 1-4 - 2021
- [c11]Cong Wang, Xiaoyang Chen, Yixin Luo, Guoqi Zhang:
Solving Virtual Network Mapping Fast by Combining Neural Network and MCTS. CBD 2021: 19-24 - [c10]Joost Romijn, Luke M. Middelburg, Sten Vollebregt, Brahim El Mansouri, Henk W. van Zeijl, Alexander May, Tobias Erlbacher, Guoqi Zhang, Pasqualina M. Sarro:
Resistive and CTAT Temperature Sensors in a Silicon Carbide CMOS Technology. IEEE SENSORS 2021: 1-4 - [c9]Guoqi Zhang, Xiaoyang Chen, Ruidong Chang, Yuhang Zhang, Cong Wang, Luyi Bai, Junwei Wang, Changming Xu:
Mastering the Game of Amazons Fast by Decoupling Network Learning. IJCNN 2021: 1-8 - [c8]Hao Hong, Li Ye, Ke Li, Pasqualina M. Sarro, Guoqi Zhang, Zewen Liu:
Fabrication of Nanoslits with Etching TSWE Method. NEMS 2021: 174-177 - 2020
- [j80]Miao Cai, Peng Cui, Yikang Qin, Daoshuang Geng, Qiqin Wei, Xiyou Wang, Dao-Guo Yang, Guoqi Zhang:
Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components - A Review. Entropy 22(2): 254 (2020) - [c7]Luke M. Middelburg, Mohammadamir Ghaderi, David Bilby, Jacobus H. Visser, G. Q. Zhang, Reinoud F. Wolffenbuttel:
Impedance Spectroscopy for Enhanced Data Collection of Conductometric Soot Sensors. ISIE 2020: 1099-1103
2010 – 2019
- 2019
- [j79]Bo Sun, Jiajie Fan, Xuejun Fan, Guoqi Zhang, Guohao Zhang:
A Reliability Prediction Methodology for LED Arrays. IEEE Access 7: 8127-8134 (2019) - [j78]Miao Cai, Yonghu Liang, Minghui Yun, Xuan-You Chen, Haidong Yan, Zhaozhe Yu, Dao-Guo Yang, Guoqi Zhang:
Effects of Thermal Reflowing Stress on Mechanical Properties of Novel SMT-SREKs. IEEE Access 7: 27106-27114 (2019) - [j77]Wei Chen, Jiajie Fan, Cheng Qian, Bin Pu, Xuejun Fan, Guoqi Zhang:
Reliability Assessment of Light-Emitting Diode Packages With Both Luminous Flux Response Surface Model and Spectral Power Distribution Method. IEEE Access 7: 68495-68502 (2019) - [j76]Miao Cai, Zhi Liang, Kunmiao Tian, Minghui Yun, Ping Zhang, Dao-Guo Yang, Guoqi Zhang:
Junction Temperature Prediction for LED Luminaires Based on a Subsystem-Separated Thermal Modeling Method. IEEE Access 7: 119755-119764 (2019) - [c6]Robert Sokolovskij, J. Zhang, H. Zheng, W. Li, Yang Jiang, G. Yang, Hongyu Yu, Pasqualina M. Sarro, G. Q. Zhang:
Recessed gate Pt-AlGaN/GaN HEMT H2 sensor. IEEE SENSORS 2019: 1-4 - [i1]Y. Ye, Richard D. Boyce, M. K. Davis, Keith O. Elliston, Christos Davatzikos, Andrey Fedorov, Jean-Christophe Fillion-Robin, Ian T. Foster, John R. Gilbertson, Mervi Heiskanen, Juli D. Klemm, Andras Lasso, James V. Miller, M. Morgan, Steve Pieper, Brigitte Raumann, B. Sarachan, G. Savova, Jonathan C. Silverstein, D. Taylor, J. Zelnis, G. Q. Zhang, Michael J. Becich:
Open Source Software Sustainability Models: Initial White Paper from the Information Technology for Cancer Research Sustainability and Industry Partnership Work Group. CoRR abs/1912.12371 (2019) - 2018
- [j75]Cheng Qian, Amir Mirza Gheitaghy, Jiajie Fan, Hongyu Tang, Bo Sun, Huaiyu Ye, Guoqi Zhang:
Thermal Management on IGBT Power Electronic Devices and Modules. IEEE Access 6: 12868-12884 (2018) - [j74]M. Yazdan Mehr, M. R. Toroghinejad, F. Karimzadeh, W. D. van Driel, G. Q. Zhang:
A review on discoloration and high accelerated testing of optical materials in LED based-products. Microelectron. Reliab. 81: 136-142 (2018) - [j73]Hao Zhang, Yang Liu, Lingen Wang, Jiajie Fan, Xuejun Fan, Fenglian Sun, Guoqi Zhang:
A new hermetic sealing method for ceramic package using nanosilver sintering technology. Microelectron. Reliab. 81: 143-149 (2018) - [j72]Jiajie Fan, Jianwu Cao, Chaohua Yu, Cheng Qian, Xuejun Fan, Guoqi Zhang:
A design and qualification of LED flip Chip-on-Board module with tunable color temperatures. Microelectron. Reliab. 84: 140-148 (2018) - [j71]Ibrahim Khalilullah, Talukder Reza, Liangbiao Chen, Mark D. Placette, A. K. M. Monayem H. Mazumder, Jiang Zhou, Jiajie Fan, Cheng Qian, Guoqi Zhang, Xuejun Fan:
In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging. Microelectron. Reliab. 84: 208-214 (2018) - [j70]Bo Sun, Xuejun Fan, Willem D. van Driel, Chengqiang Cui, Guoqi Zhang:
A stochastic process based reliability prediction method for LED driver. Reliab. Eng. Syst. Saf. 178: 140-146 (2018) - [j69]Ning Yang, Dao-Guo Yang, Guoqi Zhang, Liangbiao Chen, Dongjing Liu, Miao Cai, Xuejun Fan:
The Effects of Graphene Stacking on the Performance of Methane Sensor: A First-Principles Study on the Adsorption, Band Gap and Doping of Graphene. Sensors 18(2): 422 (2018) - 2017
- [j68]Hongyu Tang, Huaiyu Ye, Xianping Chen, Cheng Qian, Xuejun Fan, Guoqi Zhang:
Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm. IEEE Access 5: 16459-16468 (2017) - [j67]Cheng Qian, Jiajie Fan, Xuejun Fan, Guoqi Zhang:
Prediction of Lumen Depreciation and Color Shift for Phosphor-Converted White Light-Emitting Diodes Based on A Spectral Power Distribution Analysis Method. IEEE Access 5: 24054-24061 (2017) - [j66]Cheng Qian, Yun Li, Jiajie Fan, Xuejun Fan, Jiajia Fu, Lixia Zhao, Guoqi Zhang:
Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method. Microelectron. Reliab. 74: 173-178 (2017) - [j65]Jiajie Fan, Chaohua Yu, Cheng Qian, Xuejun Fan, Guoqi Zhang:
Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages. Microelectron. Reliab. 74: 179-185 (2017) - [j64]Liangbiao Chen, Jiang Zhou, Hsing-wei Chu, Guoqi Zhang, Xuejun Fan:
Modeling nonlinear moisture diffusion in inhomogeneous media. Microelectron. Reliab. 75: 162-170 (2017) - [j63]M. Yazdan Mehr, M. R. Toroghinejad, F. Karimzadeh, W. D. van Driel, G. Q. Zhang:
Reliability and diffusion-controlled through thickness oxidation of optical materials in LED-based products. Microelectron. Reliab. 78: 143-147 (2017) - [j62]Hongyu Tang, Huaiyu Ye, Cell K. Y. Wong, Stanely Y. Y. Leung, Jiajie Fan, Xianping Chen, Xuejun Fan, Guoqi Zhang:
Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component. Microelectron. Reliab. 78: 197-204 (2017) - [j61]Guangjun Lu, W. D. van Driel, Xuejun Fan, Jiajie Fan, Cheng Qian, G. Q. Zhang:
Color shift acceleration on mid-power LED packages. Microelectron. Reliab. 78: 294-298 (2017) - [j60]Bo Sun, Xuejun Fan, Huaiyu Ye, Jiajie Fan, Cheng Qian, Willem D. van Driel, Guoqi Zhang:
A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation. Reliab. Eng. Syst. Saf. 163: 14-21 (2017) - [j59]Jianfei Dong, Guoqi Zhang:
Identification and Robust Control of the Nonlinear Photoelectrothermal Dynamics of LED Systems. IEEE Trans. Ind. Electron. 64(3): 2215-2225 (2017) - [c5]Luke M. Middelburg, Brahim El Mansouri, Henk W. van Zeijl, G. Q. Zhang, R. H. Poelma:
High aspect ratio spiral resonators for process variation investigation and MEMS applications. IEEE SENSORS 2017: 1-3 - [c4]Robert Sokolovskij, Elina Iervolino, Changhui Zhao, Fei Wang, Hongyu Yu, Fabio Santagata, Pasqualina M. Sarro, Guoqi Zhang:
Pt-AlGaN/GaN HEMT-sensor layout optimization for enhancement of hydrogen detection. IEEE SENSORS 2017: 1-3 - 2016
- [j58]Yongchun Xie, Huang Huang, Yong Hu, Guoqi Zhang:
Applications of advanced controlmethods in spacecrafts: progress, challenges, and future prospects. Frontiers Inf. Technol. Electron. Eng. 17(9): 841-861 (2016) - [j57]Miao Cai, Dao-Guo Yang, Jianna Zheng, Jianlin Huang, Dongjing Liu, Jing Xiao, Ping Zhang, Guoqi Zhang, Xianping Chen:
Effects of stress-loading test methods on the degradation of light-emitting diode modules. Microelectron. Reliab. 64: 635-639 (2016) - [j56]Jianlin Huang, Dusan S. Golubovic, Sau Koh, Dao-Guo Yang, Xiupeng Li, Xuejun Fan, G. Q. Zhang:
Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test. Reliab. Eng. Syst. Saf. 154: 152-159 (2016) - [j55]Bo Sun, Xuejun Fan, Cheng Qian, Guoqi Zhang:
PoF-Simulation-Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers. IEEE Trans. Ind. Electron. 63(11): 6726-6735 (2016) - 2015
- [j54]Yang Liu, Fenglian Sun, Hao Zhang, Tong Xin, Cadmus A. Yuan, Guoqi Zhang:
Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes. Microelectron. Reliab. 55(8): 1234-1240 (2015) - [j53]Miao Cai, Dao-Guo Yang, Kunmiao Tian, Ping Zhang, Xianping Chen, Lilin Liu, Guoqi Zhang:
Step-stress accelerated testing of high-power LED lamps based on subsystem isolation method. Microelectron. Reliab. 55(9-10): 1784-1789 (2015) - [j52]Jianlin Huang, Dusan S. Golubovic, Sau Koh, Dao-Guo Yang, Xiupeng Li, Xuejun Fan, G. Q. Zhang:
Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests. Microelectron. Reliab. 55(12): 2654-2662 (2015) - 2014
- [j51]M. Yazdan Mehr, W. D. van Driel, Kaspar M. B. Jansen, P. Deeben, G. Q. Zhang:
Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products. Microelectron. Reliab. 54(1): 138-142 (2014) - [j50]S. Tarashioon, W. D. van Driel, G. Q. Zhang:
Multi-physics reliability simulation for solid state lighting drivers. Microelectron. Reliab. 54(6-7): 1212-1222 (2014) - [j49]Huaiyu Ye, Jia Wei, Henk W. van Zeijl, Pasqualina M. Sarro, Guoqi Zhang:
Fabrication and application of temperature triggered MEMS switch for active cooling control in Solid State Lighting system. Microelectron. Reliab. 54(6-7): 1338-1343 (2014) - [j48]Huaiyu Ye, Robert Sokolovskij, Henk W. van Zeijl, Alexander W. J. Gielen, Guoqi Zhang:
A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting diodes. Microelectron. Reliab. 54(6-7): 1355-1362 (2014) - [j47]M. Yazdan Mehr, Willem D. van Driel, G. Q. Zhang:
Accelerated life time testing and optical degradation of remote phosphor plates. Microelectron. Reliab. 54(8): 1544-1548 (2014) - [j46]Yang Liu, Stanley Y. Y. Leung, Jia Zhao, Cell K. Y. Wong, Cadmus A. Yuan, Guoqi Zhang, Fenglian Sun, Liangliang Luo:
Thermal and mechanical effects of voids within flip chip soldering in LED packages. Microelectron. Reliab. 54(9-10): 2028-2033 (2014) - [j45]M. Yazdan Mehr, Willem D. van Driel, Sau Koh, Guoqi Zhang:
Reliability and optical properties of LED lens plates under high temperature stress. Microelectron. Reliab. 54(11): 2440-2447 (2014) - [j44]Huaiyu Ye, Bo Li, Hongyu Tang, Jia Zhao, Cadmus A. Yuan, Guoqi Zhang:
Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes. Microelectron. Reliab. 54(11): 2448-2455 (2014) - [c3]Zahra Kolahdouz Esfahani, Teng Ma, Henk W. van Zeijl, G. Q. Zhang, Ali Rostamian, Mohammadreza Kolahdouz:
Blue selective photodiodes for optical feedback in LED wafer level packages. ESSDERC 2014: 174-177 - 2013
- [j43]Miao Cai, D. J. Xie, W. B. Chen, B. Y. Wu, Dao-Guo Yang, G. Q. Zhang:
A novel soldering method to evaluate PCB pad cratering for pin-pull testing. Microelectron. Reliab. 53(9-11): 1568-1574 (2013) - [c2]F. Santagata, G. Almanno, Sten Vollebregt, Cinzia Silvestri, G. Q. Zhang, Pasqualina M. Sarro:
Carbon Nanotube based heat-sink for solid state lighting. NEMS 2013: 1214-1217 - 2012
- [j42]S. Tarashioon, Alessandro Baiano, Henk W. van Zeijl, C. Guo, S. W. Koh, W. D. van Driel, G. Q. Zhang:
An approach to "Design for Reliability" in solid state lighting systems at high temperatures. Microelectron. Reliab. 52(5): 783-793 (2012) - [j41]R. H. Poelma, H. Sadeghian, Sau Koh, G. Q. Zhang:
Effects of single vacancy defect position on the stability of carbon nanotubes. Microelectron. Reliab. 52(7): 1279-1284 (2012) - [j40]Jianfei Dong, Ashish Pandharipande, Willem D. van Driel, Guoqi Zhang:
Diagnosing Lumen Depreciation in LED Lighting Systems: An Estimation Approach. IEEE Trans. Signal Process. 60(7): 3796-3808 (2012) - [c1]Joseph Teagno, Richard C. Kiefer, Jyotishman Pathak, G. Q. Zhang, Satya Sanket Sahoo:
A Distributed Semantic Web Approach for Cohort Identification. AMIA 2012 - 2010
- [j39]Xiaosong Ma, Kaspar M. B. Jansen, G. Q. Zhang, Willem D. van Driel, Olaf van der Sluis, Leo J. Ernst, C. Regards, Christian Gautier, Hélène Frémont:
A fast moisture sensitivity level qualification method. Microelectron. Reliab. 50(9-11): 1654-1660 (2010) - [j38]Jeroen J. M. Zaal, Willem D. van Driel, G. Q. Zhang:
Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices. Sensors 10(4): 3989-4001 (2010)
2000 – 2009
- 2009
- [j37]Jeroen J. M. Zaal, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. Zhang:
Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull. Microelectron. Reliab. 49(8): 846-852 (2009) - [j36]Olaf van der Sluis, R. A. B. Engelen, P. H. M. Timmermans, G. Q. Zhang:
Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics. Microelectron. Reliab. 49(8): 853-860 (2009) - [j35]Y. Liu, F. J. H. G. Kessels, Willem D. van Driel, J. A. S. van Driel, F. L. Sun, G. Q. Zhang:
Comparing drop impact test method using strain gauge measurements. Microelectron. Reliab. 49(9-11): 1299-1303 (2009) - [j34]S. P. M. Noijen, Olaf van der Sluis, P. H. M. Timmermans, G. Q. Zhang:
Numerical prediction of failure paths at a roughened metal/polymer interface. Microelectron. Reliab. 49(9-11): 1315-1318 (2009) - 2008
- [j33]Cadmus A. Yuan, Olaf van der Sluis, Willem D. van Driel, G. Q. (Kouchi) Zhang:
The need for multi-scale approaches in Cu/low-k reliability issues. Microelectron. Reliab. 48(6): 833-842 (2008) - [j32]Fenglian Sun, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. (Kouchi) Zhang:
Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP. Microelectron. Reliab. 48(8-9): 1167-1170 (2008) - [j31]W. D. van Driel, Dao-Guo Yang, G. Q. Zhang:
On chip-package stress interaction. Microelectron. Reliab. 48(8-9): 1268-1272 (2008) - [j30]Q. Li, J. F. L. Goosen, J. T. M. van Beek, Fred van Keulen, K. L. Phan, G. Q. Zhang:
Failure analysis of a thin-film nitride MEMS package. Microelectron. Reliab. 48(8-9): 1557-1561 (2008) - [j29]Jeroen J. M. Zaal, W. D. van Driel, S. Bendida, Q. Li, J. T. M. van Beek, G. Q. Zhang:
Packaging influences on the reliability of MEMS resonators. Microelectron. Reliab. 48(8-9): 1567-1571 (2008) - 2007
- [j28]Marcel A. J. van Gils, Olaf van der Sluis, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken:
Analysis of Cu/low-k bond pad delamination by using a novel failure index. Microelectron. Reliab. 47(2-3): 179-186 (2007) - [j27]W. D. van Driel, A. Mavinkurve, Marcel A. J. van Gils, G. Q. Zhang:
Advanced structural similarity rules for the BGA package family. Microelectron. Reliab. 47(2-3): 205-214 (2007) - [j26]Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, H. J. L. Bressers, J. H. J. Janssen:
Effect of filler concentration of rubbery shear and bulk modulus of molding compounds. Microelectron. Reliab. 47(2-3): 233-239 (2007) - [j25]C. van't Hof, Kaspar M. B. Jansen, G. Wisse, Leo J. Ernst, Dao-Guo Yang, G. Q. Zhang, H. J. L. Bressers:
Novel shear tools for viscoelastic characterization of packaging polymers. Microelectron. Reliab. 47(2-3): 240-247 (2007) - [j24]Viktor Gonda, Kaspar M. B. Jansen, Leo J. Ernst, Jaap M. J. den Toonder, G. Q. Zhang:
Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques. Microelectron. Reliab. 47(2-3): 248-251 (2007) - [j23]Marcel A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, Richard B. R. van Silfhout, X. J. Fan, J. H. J. Janssen:
Virtual qualification of moisture induced failures of advanced packages. Microelectron. Reliab. 47(2-3): 273-279 (2007) - [j22]Artur Wymyslowski, W. D. van Driel, J. van de Peer, N. Tzannetakis, G. Q. Zhang:
Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability. Microelectron. Reliab. 47(2-3): 280-289 (2007) - [j21]H. J. L. Bressers, W. D. van Driel, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang:
Correlation between chemistry of polymer building blocks and microelectronics reliability. Microelectron. Reliab. 47(2-3): 290-294 (2007) - [j20]Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen:
Numerical modeling of warpage induced in QFN array molding process. Microelectron. Reliab. 47(2-3): 310-318 (2007) - [j19]Cadmus A. Yuan, Olaf van der Sluis, G. Q. (Kouchi) Zhang, Leo J. Ernst, Willem D. van Driel, Richard B. R. van Silfhout:
Molecular simulation on the material/interfacial strength of the low-dielectric materials. Microelectron. Reliab. 47(9-11): 1483-1491 (2007) - [j18]Xiaosong Ma, Kaspar M. B. Jansen, Leo J. Ernst, W. D. van Driel, Olaf van der Sluis, G. Q. Zhang:
Characterization of moisture properties of polymers for IC packaging. Microelectron. Reliab. 47(9-11): 1685-1689 (2007) - [j17]Willem D. van Driel, Dao-Guo Yang, Cadmus A. Yuan, M. van Kleef, G. Q. (Kouchi) Zhang:
Mechanical reliability challenges for MEMS packages: Capping. Microelectron. Reliab. 47(9-11): 1823-1826 (2007) - 2006
- [j16]G. Q. Zhang, K. K. Lai:
Combining path relinking and genetic algorithms for the multiple-level warehouse layout problem. Eur. J. Oper. Res. 169(2): 413-425 (2006) - [j15]A. J. van Roosmalen, G. Q. Zhang:
Reliability challenges in the nanoelectronics era. Microelectron. Reliab. 46(9-11): 1403-1414 (2006) - [j14]R. L. J. M. Ubachs, Olaf van der Sluis, W. D. van Driel, G. Q. Zhang:
Multiscale modelling of multilayer substrates. Microelectron. Reliab. 46(9-11): 1472-1477 (2006) - [j13]Cadmus A. Yuan, Willem D. van Driel, Richard B. R. van Silfhout, Olaf van der Sluis, Roy A. B. Engelen, Leo J. Ernst, Fred van Keulen, G. Q. Zhang:
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. Microelectron. Reliab. 46(9-11): 1679-1684 (2006) - [j12]W. D. van Driel, Olaf van der Sluis, Dao-Guo Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang:
Reliability modelling for packages in flexible end-products. Microelectron. Reliab. 46(9-11): 1880-1885 (2006) - 2005
- [j11]W. D. van Driel, Marcel A. J. van Gils, Richard B. R. van Silfhout, G. Q. Zhang:
Prediction of Delamination Related IC & Packaging Reliability Problems. Microelectron. Reliab. 45(9-11): 1633-1638 (2005) - 2004
- [j10]Müge Erinc, Piet J. G. Schreurs, G. Q. Zhang, Marc G. D. Geers:
Characterization and fatigue damage simulation in SAC solder joints. Microelectron. Reliab. 44(9-11): 1287-1292 (2004) - [j9]Marcel A. J. van Gils, P. J. J. H. A. Habets, G. Q. Zhang, Willem D. van Driel, Piet J. G. Schreurs:
Characterization and Modelling of Moisture Driven Interface Failures. Microelectron. Reliab. 44(9-11): 1317-1322 (2004) - [j8]G. Q. Zhang, Jaap Bisschop:
Integrated thermo-mechanical design and qualification of wafer backend structures. Microelectron. Reliab. 44(9-11): 1349-1354 (2004) - [j7]Dao-Guo Yang, J. S. Liang, Quan-Yong Li, Leo J. Ernst, G. Q. Zhang:
Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach. Microelectron. Reliab. 44(12): 1947-1955 (2004) - [j6]Xuejun Fan, Jiang Zhou, G. Q. Zhang:
Multi-physics modeling in virtual prototyping of electronic packages--combined thermal, thermo-mechanical and vapor pressure modeling. Microelectron. Reliab. 44(12): 1967-1976 (2004) - [j5]Y. T. He, Marcel A. J. van Gils, Willem D. van Driel, G. Q. Zhang, Richard B. R. van Silfhout, Leo J. Ernst:
Prediction of crack growth in IC passivation layers. Microelectron. Reliab. 44(12): 2003-2009 (2004) - [j4]Viktor Gonda, Jaap M. J. den Toonder, Johan Beijer, G. Q. Zhang, Willem D. van Driel, Romano J. O. M. Hoofman, Leo J. Ernst:
Prediction of thermo-mechanical integrity of wafer backend processes. Microelectron. Reliab. 44(12): 2011-2017 (2004) - [j3]Willem D. van Driel, C. J. Liu, G. Q. Zhang, J. H. J. Janssen, Richard B. R. van Silfhout, Marcel A. J. van Gils, Leo J. Ernst:
Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. Microelectron. Reliab. 44(12): 2019-2027 (2004) - 2003
- [j2]W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, Leo J. Ernst, Fei Su, Kerm Sin Chian, Sung Yi:
Prediction and verification of process induced warpage of electronic packages. Microelectron. Reliab. 43(5): 765-774 (2003) - [j1]G. Q. Zhang:
The challenges of virtual prototyping and qualification for future microelectronics. Microelectron. Reliab. 43(9-11): 1777-1783 (2003)
Coauthor Index
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