"Numerical analysis of delamination and cracking phenomena in multi-layered ..."

Olaf van der Sluis et al. (2009)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2009.03.013

access: closed

type: Journal Article

metadata version: 2023-09-30

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/SluisETZ09
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/SluisETZ09
Olaf van der Sluis, R. A. B. Engelen, P. H. M. Timmermans, G. Q. Zhang:
Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics. Microelectron. Reliab. 49(8): 853-860 (2009)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.