"Delamination analysis of Cu/low-k technology subjected to ..."

Cadmus A. Yuan et al. (2006)

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DOI: 10.1016/J.MICROREL.2006.07.054

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type: Journal Article

metadata version: 2023-09-30

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Cadmus A. Yuan, Willem D. van Driel, Richard B. R. van Silfhout, Olaf van der Sluis, Roy A. B. Engelen, Leo J. Ernst, Fred van Keulen, G. Q. Zhang:
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. Microelectron. Reliab. 46(9-11): 1679-1684 (2006)

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