"Failure analysis of a thin-film nitride MEMS package."

Q. Li et al. (2008)

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DOI: 10.1016/J.MICROREL.2008.07.036

access: closed

type: Journal Article

metadata version: 2020-02-22

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Q. Li, J. F. L. Goosen, J. T. M. van Beek, Fred van Keulen, K. L. Phan, G. Q. Zhang:
Failure analysis of a thin-film nitride MEMS package. Microelectron. Reliab. 48(8-9): 1557-1561 (2008)

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