"Integrated thermo-mechanical design and qualification of wafer backend ..."

G. Q. Zhang, Jaap Bisschop (2004)

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DOI: 10.1016/J.MICROREL.2004.07.031

access: closed

type: Journal Article

metadata version: 2020-02-22

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G. Q. Zhang, Jaap Bisschop:
Integrated thermo-mechanical design and qualification of wafer backend structures. Microelectron. Reliab. 44(9-11): 1349-1354 (2004)

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