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"Interfacial reaction and failure mode analysis of the solder joints for ..."
Yang Liu et al. (2015)
- Yang Liu
, Fenglian Sun, Hao Zhang, Tong Xin, Cadmus A. Yuan, Guoqi Zhang:
Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes. Microelectron. Reliab. 55(8): 1234-1240 (2015)
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