"Interfacial reaction and failure mode analysis of the solder joints for ..."

Yang Liu et al. (2015)

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DOI: 10.1016/J.MICROREL.2015.05.005

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yang Liu, Fenglian Sun, Hao Zhang, Tong Xin, Cadmus A. Yuan, Guoqi Zhang:
Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes. Microelectron. Reliab. 55(8): 1234-1240 (2015)

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