"Parametric study on flip chip package with lead-free solder joints by ..."

Dao-Guo Yang et al. (2004)

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DOI: 10.1016/J.MICROREL.2004.04.023

access: closed

type: Journal Article

metadata version: 2020-02-22

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Dao-Guo Yang, J. S. Liang, Quan-Yong Li, Leo J. Ernst, G. Q. Zhang:
Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach. Microelectron. Reliab. 44(12): 1947-1955 (2004)

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