default search action
Google
Google Scholar
Semantic Scholar
Internet Archive Scholar
CiteSeerX
ORCIDArtur Wymyslowski
Person information
Refine list
refinements active!
zoomed in on ?? of ?? records
view refined list in
export refined list as
2010 – 2019
- 2017
[j22]Artur Wymyslowski:
Guest Editorial: 2016 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Microelectron. Reliab. 74: 118-120 (2017)- 2016
- [j21]Artur Wymyslowski:
Guest Editorial: 2015 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Microelectron. Reliab. 62: 1-3 (2016) - 2015
- [j20]Artur Wymyslowski:
Guest Editorial: 2014 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Microelectron. Reliab. 55(5): 713-715 (2015) - [j19]Dawid Jan Król, Artur Wymyslowski, Kamil Nouri Allaf:
Adhesion work analysis through molecular modeling and wetting angle measurement. Microelectron. Reliab. 55(5): 758-764 (2015) - 2014
- [j18]Artur Wymyslowski:
Guest Editorial: 2013 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Microelectron. Reliab. 54(6-7): 1179-1181 (2014) - [c1]Ryszard Swierczynski, Krzysztof Urbanski, Artur Wymyslowski:
Improving co-design of smart sensor front-ends. MIXDES 2014: 236-240 - 2013
- [j17]Artur Wymyslowski, Lukasz Dowhan:
Application of nanoindentation technique for investigation of elasto-plastic properties of the selected thin film materials. Microelectron. Reliab. 53(3): 443-451 (2013) - [j16]Didier Chicot
, K. Tilkin, K. Jankowski, Artur Wymyslowski:
Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique. Microelectron. Reliab. 53(5): 761-766 (2013) - [j15]Artur Wymyslowski:
Guest Editorial: 2012 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Microelectron. Reliab. 53(8): 1043-1044 (2013) - 2012
- [j14]Artur Wymyslowski:
2011 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectron. Reliab. 52(7): 1253-1254 (2012) - [j13]E. R. Weltevreden, S. J. Tesarski, Artur Wymyslowski, Müge Erinc, Alexander W. J. Gielen:
A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging. Microelectron. Reliab. 52(7): 1300-1305 (2012) - 2011
- [j12]Artur Wymyslowski:
2010 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectron. Reliab. 51(6): 1025-1026 (2011) - [j11]Lukasz Dowhan, Artur Wymyslowski, Pawel Janus, Magdalena Ekwinska, Olaf Wittler:
Extraction of elastic-plastic material properties of thin films through nanoindentaion technique with support of numerical methods. Microelectron. Reliab. 51(6): 1046-1053 (2011) - [j10]Lukasz Dowhan, Artur Wymyslowski, Stanislaw Kalicinski, Pawel Janus:
Numerical prototyping methods in microsystem accelerometers design. Microelectron. Reliab. 51(7): 1276-1282 (2011) - 2010
- [j9]Artur Wymyslowski:
Guest Editorial: 2009 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectron. Reliab. 50(7): 891-892 (2010)
2000 – 2009
- 2009
- [j8]Artur Wymyslowski:
Guest Editorial: 2008 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectron. Reliab. 49(8): 823-824 (2009) - 2008
- [j7]Artur Wymyslowski:
Guest Editorial: 2007 EuroSimE conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectron. Reliab. 48(6): 803-804 (2008) - [j6]Lukasz Dowhan, Artur Wymyslowski, Rainer Dudek:
An approach of numerical multi-objective optimization in stacked packaging. Microelectron. Reliab. 48(6): 851-857 (2008) - 2007
- [j5]Artur Wymyslowski, Bart Vandevelde, Dag Andersson:
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectron. Reliab. 47(2-3): 159-160 (2007) - [j4]Artur Wymyslowski, W. D. van Driel, J. van de Peer, N. Tzannetakis, G. Q. Zhang:
Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability. Microelectron. Reliab. 47(2-3): 280-289 (2007) - [j3]Tomasz Falat, Artur Wymyslowski, Jana Kolbe:
Numerical approach to characterization of thermally conductive adhesives. Microelectron. Reliab. 47(2-3): 342-346 (2007) - [j2]Artur Wymyslowski:
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectron. Reliab. 47(12): 1967-1968 (2007) - [j1]Tomasz Falat, Artur Wymyslowski, Jana Kolbe, Kaspar M. B. Jansen, Leo J. Ernst:
Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach. Microelectron. Reliab. 47(12): 1989-1996 (2007)
Coauthor Index
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.
Unpaywalled article links
Add open access links from 
to the list of external document links (if available).
Privacy notice: By enabling the option above, your browser will contact the API of unpaywall.org to load hyperlinks to open access articles. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the Unpaywall privacy policy.
Archived links via Wayback Machine
For web page which are no longer available, try to retrieve content from the 
of the Internet Archive (if available).
Privacy notice: By enabling the option above, your browser will contact the API of archive.org to check for archived content of web pages that are no longer available. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the Internet Archive privacy policy.
Reference lists
Add a list of references from 
, 
, and 
to record detail pages.
load references from crossref.org and opencitations.net
Privacy notice: By enabling the option above, your browser will contact the APIs of crossref.org, opencitations.net, and semanticscholar.org to load article reference information. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the Crossref privacy policy and the OpenCitations privacy policy, as well as the AI2 Privacy Policy covering Semantic Scholar.
Citation data
Add a list of citing articles from and to record detail pages.
load citations from opencitations.net
Privacy notice: By enabling the option above, your browser will contact the API of opencitations.net and semanticscholar.org to load citation information. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the OpenCitations privacy policy as well as the AI2 Privacy Policy covering Semantic Scholar.
OpenAlex data
Load additional information about publications from 
.
Privacy notice: By enabling the option above, your browser will contact the API of openalex.org to load additional information. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the information given by OpenAlex.
last updated on 2024-04-24 23:20 CEST by the dblp team
all metadata released as open data under CC0 1.0 license
see also: Terms of Use | Privacy Policy | Imprint
dblp was originally created in 1993 at:
since 2018, dblp has been operated and maintained by:
the dblp computer science bibliography is funded and supported by:
