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ORCIDRainer Dudek
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2010 – 2019
- 2018
[j9]Rainer Dudek, M. Hildebrand, Sven Rzepka
, T. Fries, Ralf Döring, Bettina Seiler, R. W. Ortmann:
Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue. Microelectron. Reliab. 83: 162-172 (2018)- 2014
- [j8]Jürgen Auersperg, Rainer Dudek, R. Jordan, O. Bochow-Neß, Sven Rzepka, Bernd Michel:
On the crack and delamination risk optimization of a Si-interposer for LED packaging. Microelectron. Reliab. 54(6-7): 1223-1227 (2014) - [j7]Jonas Johansson, Ilja Belov, Erland Johnson, Rainer Dudek, Peter Leisner:
Investigation on thermal fatigue of SnAgCu, Sn100C, and SnPbAg solder joints in varying temperature environments. Microelectron. Reliab. 54(11): 2523-2535 (2014) - 2013
- [j6]J. Keller, Raul Mrossko, H. Dobrinski, J. Stürmann, Ralf Döring, Rainer Dudek, Sven Rzepka, Bernd Michel:
Effect of moisture swelling on MEMS packaging and integrated sensors. Microelectron. Reliab. 53(9-11): 1648-1654 (2013) - 2012
- [j5]Rainer Dudek, Reinhard Pufall, Bettina Seiler, Bernd Michel:
Studies on the reliability of power packages based on strength and fracture criteria. Microelectron. Reliab. 52(7): 1255-1265 (2012) - [j4]Reinhard Pufall, Michael Goroll, Joachim Mahler, Werner Kanert, M. Bouazza, Olaf Wittler, Rainer Dudek:
Degradation of moulding compounds during highly accelerated stress tests - A simple approach to study adhesion by performing button shear tests. Microelectron. Reliab. 52(7): 1266-1271 (2012)
2000 – 2009
- 2009
- [j3]Rainer Dudek, Ralf Döring, Christine Bombach, Bernd Michel:
Simulation based analysis of secondary effects on solder fatigue. Microelectron. Reliab. 49(8): 839-845 (2009) - 2008
- [j2]Lukasz Dowhan, Artur Wymyslowski, Rainer Dudek:
An approach of numerical multi-objective optimization in stacked packaging. Microelectron. Reliab. 48(6): 851-857 (2008) - 2007
- [j1]Mike Roellig, Rainer Dudek, Steffen Wiese, Bjoern Boehme, Bernhard Wunderle, Klaus-Jürgen Wolter, Bernd Michel:
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept. Microelectron. Reliab. 47(2-3): 187-195 (2007)
Coauthor Index
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