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ORCIDBernd Michel
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2010 – 2019
- 2014
[j14]Jürgen Auersperg, Rainer Dudek, R. Jordan, O. Bochow-Neß, Sven Rzepka
, Bernd Michel:
On the crack and delamination risk optimization of a Si-interposer for LED packaging. Microelectron. Reliab. 54(6-7): 1223-1227 (2014)- [j13]Florian Schindler-Saefkow, Florian Rost, Alexander Otto, R. Pantou, Raul Mroßko, Bernhard Wunderle, Bernd Michel, Sven Rzepka, Jürgen Keller:
Stress impact of moisture diffusion measured with the stress chip. Microelectron. Reliab. 54(6-7): 1243-1252 (2014) - [j12]Dietmar Vogel, Ellen Auerswald, Jürgen Auersperg, Parisa Bayat, Raul D. Rodriguez, Dietrich R. T. Zahn, Sven Rzepka, Bernd Michel:
Stress analyses of high spatial resolution on TSV and BEoL structures. Microelectron. Reliab. 54(9-10): 1963-1968 (2014) - 2013
- [j11]J. Keller, Raul Mrossko, H. Dobrinski, J. Stürmann, Ralf Döring, Rainer Dudek, Sven Rzepka, Bernd Michel:
Effect of moisture swelling on MEMS packaging and integrated sensors. Microelectron. Reliab. 53(9-11): 1648-1654 (2013) - 2012
- [j10]Rainer Dudek, Reinhard Pufall, Bettina Seiler, Bernd Michel:
Studies on the reliability of power packages based on strength and fracture criteria. Microelectron. Reliab. 52(7): 1255-1265 (2012) - [j9]O. Hölck, Jörg Bauer, Olaf Wittler, Bernd Michel, Bernhard Wunderle:
Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination. Microelectron. Reliab. 52(7): 1285-1290 (2012) - 2011
- [j8]O. Hölck, E. Dermitzaki, Bernhard Wunderle, Jörg Bauer, Bernd Michel:
Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modelling. Microelectron. Reliab. 51(6): 1027-1034 (2011) - 2010
- [j7]Bernhard Wunderle, E. Dermitzaki, O. Hölck, Jörg Bauer, Hans Walter, Q. Shaik, K. Rätzke, Franz Faupel, Bernd Michel, Herbert Reichl:
Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling. Microelectron. Reliab. 50(7): 900-909 (2010)
2000 – 2009
- 2009
- [j6]Rainer Dudek, Ralf Döring, Christine Bombach, Bernd Michel:
Simulation based analysis of secondary effects on solder fatigue. Microelectron. Reliab. 49(8): 839-845 (2009) - 2007
- [j5]Mike Roellig, Rainer Dudek, Steffen Wiese, Bjoern Boehme, Bernhard Wunderle, Klaus-Jürgen Wolter, Bernd Michel:
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept. Microelectron. Reliab. 47(2-3): 187-195 (2007) - [j4]M. Spraul, Wolfgang Nüchter, A. Möller, Bernhard Wunderle, Bernd Michel:
Reliability of SnPb and Pb-free flip-chips under different test conditions. Microelectron. Reliab. 47(2-3): 252-258 (2007) - 2006
- [j3]Bernhard Wunderle, Bernd Michel:
Progress in reliability research in the micro and nano region. Microelectron. Reliab. 46(9-11): 1685-1694 (2006) - 2004
- [j2]Bernhard Wunderle, Wolfgang Nüchter, Andreas Schubert, Bernd Michel, Herbert Reichl:
Parametric FE-approach to flip-chip reliability under various loading conditions. Microelectron. Reliab. 44(12): 1933-1945 (2004) - 2001
- [j1]Ulrich Wagner, J. Franz, M. Schweiker, Winfried Bernhard, Roland Müller-Fiedler, Bernd Michel, Oliver Paul:
Mechanical Reliability of MEMS-structures under shock load. Microelectron. Reliab. 41(9-10): 1657-1662 (2001)
Coauthor Index
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