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O. Bochow-Neß

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2014
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Jürgen Auersperg, Rainer Dudek, R. Jordan, O. Bochow-Neß, Sven Rzepka, Bernd Michel:
On the crack and delamination risk optimization of a Si-interposer for LED packaging. Microelectron. Reliab. 54(6-7): 1223-1227 (2014)

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