"Fatigue analysis of miniaturized lead-free solder contacts based on a ..."

Mike Roellig et al. (2007)

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DOI: 10.1016/J.MICROREL.2006.09.013

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type: Journal Article

metadata version: 2023-09-30

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Mike Roellig, Rainer Dudek, Steffen Wiese, Bjoern Boehme, Bernhard Wunderle, Klaus-Jürgen Wolter, Bernd Michel:
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept. Microelectron. Reliab. 47(2-3): 187-195 (2007)

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