"Investigation on thermal fatigue of SnAgCu, Sn100C, and SnPbAg solder ..."

Jonas Johansson et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.06.007

access: closed

type: Journal Article

metadata version: 2020-02-22

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Jonas Johansson, Ilja Belov, Erland Johnson, Rainer Dudek, Peter Leisner:
Investigation on thermal fatigue of SnAgCu, Sn100C, and SnPbAg solder joints in varying temperature environments. Microelectron. Reliab. 54(11): 2523-2535 (2014)

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