"Reliability analysis of solder joints due to creep and fatigue in ..."

Didier Chicot et al. (2013)

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DOI: 10.1016/J.MICROREL.2013.01.008

access: closed

type: Journal Article

metadata version: 2020-11-05

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Didier Chicot, K. Tilkin, K. Jankowski, Artur Wymyslowski:
Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique. Microelectron. Reliab. 53(5): 761-766 (2013)

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