"A multi-scale approach of the thermo-mechanical properties of ..."

E. R. Weltevreden et al. (2012)

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DOI: 10.1016/J.MICROREL.2012.03.013

access: closed

type: Journal Article

metadata version: 2020-02-22

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E. R. Weltevreden, S. J. Tesarski, Artur Wymyslowski, Müge Erinc, Alexander W. J. Gielen:
A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging. Microelectron. Reliab. 52(7): 1300-1305 (2012)

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