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ORCIDTaeyoung Kim 0001
Person information
- affiliation: Intel Corporation, Hillsboro, OR, USA
- affiliation (former): University of California, Riverside, USA
Other persons with the same name
- Taeyoung Kim (aka: TaeYoung Kim, Tae-young Kim, Tae-Young Kim) — disambiguation page
- Taeyoung Kim 0002
![[0000-0003-1776-2717]](https://dblp.uni-trier.de./img/orcid-mark.12x12.png "0000-0003-1776-2717")
— Gyeongsang National University, Food and Resource Economics, Jinju, South Korea (and 2 more)
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Books and Theses
- 2017
[b1]Taeyoung Kim:
System-Level Electromigration-Induced Dynamic Reliability Management. University of California, Riverside, USA, 2017
Journal Articles
- 2018
- [j13]Sheldon X.-D. Tan, Hussam Amrouch, Taeyoung Kim, Zeyu Sun, Chase Cook, Jörg Henkel:
Recent advances in EM and BTI induced reliability modeling, analysis and optimization (invited). Integr. 60: 132-152 (2018) - [j12]Taeyoung Kim, Sheldon X.-D. Tan, Chase Cook, Zeyu Sun:
Detection of counterfeited ICs via on-chip sensor and post-fabrication authentication policy. Integr. 63: 31-40 (2018) - [j11]Taeyoung Kim, Zao Liu, Sheldon X.-D. Tan:
Dynamic reliability management based on resource-based EM modeling for multi-core microprocessors. Microelectron. J. 74: 106-115 (2018) - [j10]Shaoyi Peng, Han Zhou, Taeyoung Kim, Hai-Bao Chen, Sheldon X.-D. Tan:
Physics-Based Compact TDDB Models for Low-k BEOL Copper Interconnects With Time-Varying Voltage Stressing. IEEE Trans. Very Large Scale Integr. Syst. 26(2): 239-248 (2018) - [j9]Shengcheng Wang, Taeyoung Kim, Zeyu Sun, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori:
Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 26(3): 531-543 (2018) - 2017
- [j8]Xin Huang, Valeriy Sukharev, Taeyoung Kim, Sheldon X.-D. Tan:
Dynamic electromigration modeling for transient stress evolution and recovery under time-dependent current and temperature stressing. Integr. 58: 518-527 (2017) - [j7]Taeyoung Kim, Zeyu Sun, Hai-Bao Chen, Hai Wang, Sheldon X.-D. Tan:
Energy and Lifetime Optimizations for Dark Silicon Manycore Microprocessor Considering Both Hard and Soft Errors. IEEE Trans. Very Large Scale Integr. Syst. 25(9): 2561-2574 (2017) - 2016
- [j6]Xin Huang, Valeriy Sukharev, Jun-Ho Choy, Marko Chew, Taeyoung Kim, Sheldon X.-D. Tan:
Electromigration assessment for power grid networks considering temperature and thermal stress effects. Integr. 55: 307-315 (2016) - [j5]Hai-Bao Chen, Sheldon X.-D. Tan, Xin Huang, Taeyoung Kim, Valeriy Sukharev:
Analytical Modeling and Characterization of Electromigration Effects for Multibranch Interconnect Trees. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35(11): 1811-1824 (2016) - [j4]Yue Zhao, Taeyoung Kim, Hosoon Shin, Sheldon X.-D. Tan, Xin Li, Hai-Bao Chen, Hai Wang:
Statistical Rare-Event Analysis and Parameter Guidance by Elite Learning Sample Selection. ACM Trans. Design Autom. Electr. Syst. 21(4): 56:1-56:21 (2016) - 2013
- [j3]Shanshan Chen, Jeff S. Brantley, Taeyoung Kim, Samuel A. Ridenour, John C. Lach:
Characterising and minimising sources of error in inertial body sensor networks. Int. J. Auton. Adapt. Commun. Syst. 6(3): 253-271 (2013) - 2012
- [j2]Woo-Yong Lee, Kyeong Hur, Taeyoung Kim, Doo Seop Eom, Jong-Ok Kim:
Large Scale Indoor Localization System Based on Wireless Sensor Networks for Ubiquitous Computing. Wirel. Pers. Commun. 63(1): 241-260 (2012) - 2008
- [j1]Doo Seop Eom, Taeyoung Kim, HyunHo Jee, Hyoil Lee, JungHyun Han:
A multi-player arcade video game platform with a wireless tangible user interface. IEEE Trans. Consumer Electron. 54(4): 1819-1824 (2008)
Conference and Workshop Papers
- 2019
- [c18]Zeyu Sun, Taeyoung Kim, Marcus Chow, Shaoyi Peng, Han Zhou, Hyoseung Kim, Daniel Wong, Sheldon X.-D. Tan:
Long-Term Reliability Management For Multitasking GPGPUs. SMACD 2019: 213-216 - 2017
- [c17]Yaoyao Ye, Taeyoung Kim, Hai-Bao Chen, Hai Wang, Esteban Tlelo-Cuautle, Sheldon X.-D. Tan:
Comprehensive detection of counterfeit ICs via on-chip sensor and post-fabrication authentication policy. SMACD 2017: 1-4 - 2016
- [c16]Xin Huang, Valeriy Sukharev, Taeyoung Kim, Hai-Bao Chen, Sheldon X.-D. Tan:
Electromigration recovery modeling and analysis under time-dependent current and temperature stressing. ASP-DAC 2016: 244-249 - [c15]Taeyoung Kim, Zeyu Sun, Chase Cook, Hengyang Zhao, Ruiwen Li, Daniel Wong, Sheldon X.-D. Tan:
Invited - Cross-layer modeling and optimization for electromigration induced reliability. DAC 2016: 30:1-30:6 - [c14]Xin Huang, Valeriy Sukharev, Zhongdong Qi, Taeyoung Kim, Sheldon X.-D. Tan:
Physics-based full-chip TDDB assessment for BEOL interconnects. DAC 2016: 45:1-45:6 - [c13]Taeyoung Kim, Xin Huang, Hai-Bao Chen, Valeriy Sukharev, Sheldon X.-D. Tan:
Learning-based dynamic reliability management for dark silicon processor considering EM effects. DATE 2016: 463-468 - [c12]Taeyoung Kim, Zeyu Sun, Chase Cook, Jagadeesh Gaddipati, Hai Wang, Hai-Bao Chen, Sheldon X.-D. Tan:
Dynamic reliability management for near-threshold dark silicon processors. ICCAD 2016: 70 - [c11]Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Taeyoung Kim, Xin Huang, Sheldon X.-D. Tan:
Voltage-based electromigration immortality check for general multi-branch interconnects. ICCAD 2016: 113 - [c10]Chase Cook, Zeyu Sun, Taeyoung Kim, Sheldon X.-D. Tan:
Finite difference method for electromigration analysis of multi-branch interconnects. SMACD 2016: 1-4 - 2015
- [c9]Hai-Bao Chen, Sheldon X.-D. Tan, Valeriy Sukharev, Xin Huang, Taeyoung Kim:
Interconnect reliability modeling and analysis for multi-branch interconnect trees. DAC 2015: 90:1-90:6 - 2014
- [c8]Tianshu Wei, Taeyoung Kim, Sangyoung Park, Qi Zhu, Sheldon X.-D. Tan, Naehyuck Chang, Sadrul Ula, Mehdi Maasoumy:
Battery Management and Application for Energy-Efficient Buildings. DAC 2014: 136:1-136:6 - [c7]Taeyoung Kim, Bowen Zheng, Hai-Bao Chen, Qi Zhu, Valeriy Sukharev, Sheldon X.-D. Tan:
Lifetime optimization for real-time embedded systems considering electromigration effects. ICCAD 2014: 434-439 - 2011
- [c6]Taeyoung Kim, Shanshan Chen, John C. Lach:
Detecting and Preventing Forward Head Posture with Wireless Inertial Body Sensor Networks. BSN 2011: 125-126 - 2010
- [c5]Shanshan Chen, Jeff S. Brantley, Taeyoung Kim, John C. Lach:
Characterizing and minimizing synchronization and calibration errors in inertial body sensor networks. BODYNETS 2010: 138-144 - [c4]Adam T. Barth, Benjamin Boudaoud, Jeff S. Brantley, Shanshan Chen, Christopher L. Cunningham, Taeyoung Kim, Harry C. Powell Jr., Samuel A. Ridenour, John C. Lach, Bradford C. Bennett:
Longitudinal high-fidelity gait analysis with wireless inertial body sensors. Wireless Health 2010: 192-193 - 2008
- [c3]HyunHo Jee, Doo Seop Eom, Taeyoung Kim, HunKi Park, Hyoil Lee, JungHyun Han:
Multi-player VR game built upon wireless sensor network. ICUIMC 2008: 525-527 - 2007
- [c2]Kwang-il Hwang, Taeyoung Kim, Doo Seop Eom:
Proactive Data Delivery Scheme with Optimal Path for Dynamic Sensor Networks. UIC 2007: 412-421 - 2006
- [c1]Doo Seop Eom, Jungshik Jang, Taeyoung Kim, JungHyun Han:
A VR Game Platform Built Upon Wireless Sensor Network. ISVC (2) 2006: 146-155
Editorship
- 2019
- [e1]Sheldon X.-D. Tan, Mehdi Baradaran Tahoori, Taeyoung Kim, Shengcheng Wang, Zeyu Sun, Saman Kiamehr:
Long-Term Reliability of Nanometer VLSI Systems, Modeling, Analysis and Optimization. Springer 2019, ISBN 978-3-030-26171-9
Coauthor Index
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