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2020 – today
- 2021
[j7]Xiaoyi Wang
, Shaobin Ma, Sheldon X.-D. Tan, Chase Cook, Liang Chen, Jianlei Yang, Wenjian Yu:
Fast Physics-Based Electromigration Analysis for Full-Chip Networks by Efficient Eigenfunction-Based Solution. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 40(3): 507-520 (2021)
2010 – 2019
- 2019
- [b1]Chase Cook:
Simulation for Reliability, Hardware Security, and Ising Computing in VLSI Chip Design. University of California, Riverside, USA, 2019 - [j6]Chase Cook, Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan:
Reliability based hardware Trojan design using physics-based electromigration models. Integr. 66: 9-15 (2019) - [j5]Chase Cook, Hengyang Zhao, Takashi Sato, Masayuki Hiromoto, Sheldon X.-D. Tan:
GPU-based Ising computing for solving max-cut combinatorial optimization problems. Integr. 69: 335-344 (2019) - [i1]Chase Cook, Wentian Jin, Sheldon X.-D. Tan:
GPU-based Ising Computing for Solving Balanced Min-Cut Graph Partitioning Problem. CoRR abs/1908.00210 (2019) - 2018
- [j4]Sheldon X.-D. Tan, Hussam Amrouch, Taeyoung Kim, Zeyu Sun, Chase Cook, Jörg Henkel:
Recent advances in EM and BTI induced reliability modeling, analysis and optimization (invited). Integr. 60: 132-152 (2018) - [j3]Taeyoung Kim, Sheldon X.-D. Tan, Chase Cook, Zeyu Sun:
Detection of counterfeited ICs via on-chip sensor and post-fabrication authentication policy. Integr. 63: 31-40 (2018) - [j2]Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Chase Cook, Sheldon X.-D. Tan:
Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 37(12): 3137-3150 (2018) - [j1]Chase Cook, Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Sheldon X.-D. Tan:
Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method. IEEE Trans. Very Large Scale Integr. Syst. 26(5): 969-980 (2018) - [c6]Chase Cook, Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan:
Reliability Based Hardware Trojan Design Using Physics-Based Electromigration Models. SMACD 2018: 5-8 - [c5]Sheriff Sadiqbatcha, Chase Cook, Zeyu Sun, Sheldon X.-D. Tan:
Accelerating Electromigration Wear-Out Effects Based on Configurable Sink-Structured Wires. SMACD 2018: 21-24 - 2017
- [c4]Xiaoyi Wang, Yan Yan, Jian He, Sheldon X.-D. Tan, Chase Cook, Shengqi Yang:
Fast physics-based electromigration analysis for multi-branch interconnect trees. ICCAD 2017: 169-176 - 2016
- [c3]Taeyoung Kim, Zeyu Sun, Chase Cook, Hengyang Zhao, Ruiwen Li, Daniel Wong, Sheldon X.-D. Tan:
Invited - Cross-layer modeling and optimization for electromigration induced reliability. DAC 2016: 30:1-30:6 - [c2]Taeyoung Kim, Zeyu Sun, Chase Cook, Jagadeesh Gaddipati, Hai Wang, Hai-Bao Chen, Sheldon X.-D. Tan:
Dynamic reliability management for near-threshold dark silicon processors. ICCAD 2016: 70 - [c1]Chase Cook, Zeyu Sun, Taeyoung Kim, Sheldon X.-D. Tan:
Finite difference method for electromigration analysis of multi-branch interconnects. SMACD 2016: 1-4
Coauthor Index
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