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ORCIDLiang Chen 0025
Person information
- affiliation: University of California, Riverside, Department of Electrical and Computer Engineering, CA, USA
- affiliation (PhD 2020): Shanghai Jiao Tong University, Department of electronic engineering, China
Other persons with the same name
- Liang Chen — disambiguation page
- Liang Chen 0001
![[0000-0002-3787-8832]](https://dblp.uni-trier.de./img/orcid-mark.12x12.png "0000-0002-3787-8832")
— Sun Yat-Sen University, School of Data and Computer Science, Guangzhou, China (and 2 more) - Liang Chen 0002 — Sun Yat-sen University, School of Communication and Design, Guangzhou, China (and 2 more)
- Liang Chen 0003 — Nanjing University of Science and Technology, School of Computer Science and Engineering, China
- Liang Chen 0004 — Beijing Institute of Technology, School of Information and Electronic, China
- Liang Chen 0005 — Huaibei Normal University, School of Mathematical Sciences, China (and 1 more)
- Liang Chen 0006 — Hunan University, College of Mathematics and Econometrics, Changsha, China
- Liang Chen 0007 — Wuhan University, LIEMARS, China (and 3 more)
- Liang Chen 0009 — Shenzhen University, College of Information Engineering, China (and 1 more)
- Liang Chen 0010 — Xidian University, State Key Laboratory of Integrated Service Networks, Xi'an, China
- Liang Chen 0011 — Chongqing College of Electronic Engineering, Electronic Technician Institute, China
- Liang Chen 0012 — Wenzhou University, College of Mathematics and Information Science, China (and 3 more)
- Liang Chen 0013 — Jiangsu Electric Power Company Research Institute, Nanjing, China
- Liang Chen 0014 — Karlsruhe Institute of Technology, Germany
- Liang Chen 0015 — Harbin Institute of Technology, School of Electronics and Information Engineering, Communications Research Center, Harbin, China
- Liang Chen 0016 — Chongqing Medical University, Department of Hepatobiliary Surgery, Chongqing, China
- Liang Chen 0017 — Zhejiang University, Institute of Cyber-Systems and Control, State Key Laboratory of Industrial Control Technology, Hangzhou, China (and 2 more)
- Liang Chen 0018 — Imperial College London, Department of Computing, Biomedical Image Analysis Group, London, UK
- Liang Chen 0019 — Ohio State Uinversity, Department of Computer Science and Engineering, Columbus, OH, USA
- Liang Chen 0020 — King Abdullah University of Science and Technology, Thuwal, Saudi Arabia
- Liang Chen 0021 — Shantou University, Key Laboratory of Intelligent Manufacturing Technology of Ministry of Education, Shantou, China (and 2 more)
- Liang Chen 0022 — Jilin University, College of Computer Science and Technology, MoE Key Laboratory of Symbolic Computation and Knowledge Engineering, Changchun, China
- Liang Chen 0023 — Fudan University, Huashan Hospital, Department of Neurosurgery, Shanghai, China
- Liang Chen 0024 — Peking University, National Key Laboratory for Multimedia Information Processing, China
- Liang Chen 0026 — Fujian Normal University, College of Photonic and Electronic Engineering, Fuzhou, China (and 1 more)
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2020 – today
- 2024
[c10]Shunxiang Lan, Min Tang, Liang Chen, Junfa Mao:
Thermal Resistance Network Derivative (TREND) Model for Efficient Thermal Simulation and Design of ICs and Packages. DAC 2024: 113:1-113:6- 2023
- [j8]Jinwei Zhang, Sheriff Sadiqbatcha, Liang Chen, Cuong Thi, Sachin Sachdeva, Hussam Amrouch, Sheldon X.-D. Tan:
Hot-spot aware thermoelectric array based cooling for multicore processors. Integr. 89: 73-82 (2023) - [j7]Liang Chen, Wentian Jin, Jinwei Zhang, Sheldon X.-D. Tan:
Thermoelectric Cooler Modeling and Optimization via Surrogate Modeling Using Implicit Physics-Constrained Neural Networks. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42(11): 4090-4101 (2023) - [j6]Liang Chen, Wentian Jin, Mohammadamir Kavousi, Subed Lamichhane, Sheldon X.-D. Tan:
Linear Time Electromigration Analysis Based on Physics-Informed Sparse Regression. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42(11): 4126-4138 (2023) - [c9]Liang Chen, Jincong Lu, Wentian Jin, Sheldon X.-D. Tan:
Fast Full-Chip Parametric Thermal Analysis Based on Enhanced Physics Enforced Neural Networks. ICCAD 2023: 1-8 - [c8]Subed Lamichhane, Wentian Jin, Liang Chen, Mohammadamir Kavousi, Sheldon X.-D. Tan:
PostPINN-EM: Fast Post-Voiding Electromigration Analysis Using Two-Stage Physics-Informed Neural Networks. ICCAD 2023: 1-9 - 2022
- [j5]Liang Chen, Sheriff Sadiqbatcha, Hussam Amrouch, Sheldon X.-D. Tan:
Electrothermal Simulation and Optimal Design of Thermoelectric Cooler Using Analytical Approach. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(9): 3066-3077 (2022) - [c7]Mohammadamir Kavousi, Liang Chen, Sheldon X.-D. Tan:
Fast Electromigration Stress Analysis Considering Spatial Joule Heating Effects. ASP-DAC 2022: 208-213 - [c6]Liang Chen, Wentian Jin, Sheldon X.-D. Tan:
Fast Thermal Analysis for Chiplet Design based on Graph Convolution Networks. ASP-DAC 2022: 485-492 - [c5]Wentian Jin, Liang Chen, Subed Lamichhane, Mohammadamir Kavousi, Sheldon X.-D. Tan:
HierPINN-EM: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnects Using Hierarchical Physics-Informed Neural Network. ICCAD 2022: 28:1-28:9 - 2021
- [j4]Han Zhou, Liang Chen, Sheldon X.-D. Tan:
Robust power grid network design considering EM aging effects for multi-segment wires. Integr. 77: 38-47 (2021) - [j3]Liang Chen, Sheldon X.-D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang, Junfa Mao:
A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment Interconnects. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 40(2): 350-363 (2021) - [j2]Xiaoyi Wang, Shaobin Ma, Sheldon X.-D. Tan, Chase Cook, Liang Chen, Jianlei Yang, Wenjian Yu:
Fast Physics-Based Electromigration Analysis for Full-Chip Networks by Efficient Eigenfunction-Based Solution. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 40(3): 507-520 (2021) - [c4]Wentian Jin, Liang Chen, Sheriff Sadiqbatcha, Shaoyi Peng, Sheldon X.-D. Tan:
EMGraph: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnect Using Graph Convolution Networks. DAC 2021: 919-924 - 2020
- [j1]Liang Chen, Sheldon X.-D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang, Junfa Mao:
Fast Analytic Electromigration Analysis for General Multisegment Interconnect Wires. IEEE Trans. Very Large Scale Integr. Syst. 28(2): 421-432 (2020) - [c3]Shaobin Ma, Xiaoyi Wang, Sheldon X.-D. Tan, Liang Chen, Jian He:
An Adaptive Electromigration Assessment Algorithm for Full-chip Power/Ground Networks. ASP-DAC 2020: 38-43 - [c2]Mohammadamir Kavousi, Liang Chen, Sheldon X.-D. Tan:
Electromigration Immortality Check considering Joule Heating Effect for Multisegment Wires. ICCAD 2020: 6:1-6:8 - [c1]Shaoyi Peng, Wentian Jin, Liang Chen, Sheldon X.-D. Tan:
Data-Driven Fast Electrostatics and TDDB Aging Analysis. MLCAD 2020: 71-76
Coauthor Index
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