"Thermal Resistance Network Derivative (TREND) Model for Efficient Thermal ..."

Shunxiang Lan et al. (2024)

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DOI: 10.1145/3649329.3657366

access: closed

type: Conference or Workshop Paper

metadata version: 2024-11-11

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Shunxiang Lan, Min Tang, Liang Chen, Junfa Mao:
Thermal Resistance Network Derivative (TREND) Model for Efficient Thermal Simulation and Design of ICs and Packages. DAC 2024: 113:1-113:6

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