"Invited - Cross-layer modeling and optimization for electromigration ..."

Taeyoung Kim et al. (2016)

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DOI: 10.1145/2897937.2905010

access: closed

type: Conference or Workshop Paper

metadata version: 2021-02-19

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  - conf/dac/KimSCZLWT16
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  - https://dblp.org/rec/conf/dac/KimSCZLWT16
Taeyoung Kim, Zeyu Sun, Chase Cook, Hengyang Zhao, Ruiwen Li, Daniel Wong, Sheldon X.-D. Tan:
Invited - Cross-layer modeling and optimization for electromigration induced reliability. DAC 2016: 30:1-30:6

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