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Shengcheng Wang
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2020 – today
- 2022
- [c9]Haozhe Zhu, Bo Jiao, Jinshan Zhang, Xinru Jia, Yunzhengmao Wang, Tianchan Guan, Shengcheng Wang, Dimin Niu, Hongzhong Zheng, Chixiao Chen, Mingyu Wang, Lihua Zhang, Xiaoyang Zeng, Qi Liu, Yuan Xie, Ming Liu:
COMB-MCM: Computing-on-Memory-Boundary NN Processor with Bipolar Bitwise Sparsity Optimization for Scalable Multi-Chiplet-Module Edge Machine Learning. ISSCC 2022: 1-3
2010 – 2019
- 2019
- [j4]Shengcheng Wang, Krishnendu Chakrabarty, Mehdi Baradaran Tahoori:
Defect Clustering-Aware Spare-TSV Allocation in 3-D ICs for Yield Enhancement. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 38(10): 1928-1941 (2019) - [e1]Sheldon X.-D. Tan, Mehdi Baradaran Tahoori, Taeyoung Kim, Shengcheng Wang, Zeyu Sun, Saman Kiamehr:
Long-Term Reliability of Nanometer VLSI Systems, Modeling, Analysis and Optimization. Springer 2019, ISBN 978-3-030-26171-9 - 2018
- [b1]Shengcheng Wang:
Reliable Design of Three-Dimensional Integrated Circuits. Karlsruhe University, Germany, 2018 - [j3]Shengcheng Wang, Ran Wang, Krishnendu Chakrabarty, Mehdi Baradaran Tahoori:
Multicast Testing of Interposer-Based 2.5D ICs: Test-Architecture Design and Test Scheduling. ACM Trans. Design Autom. Electr. Syst. 23(3): 35:1-35:25 (2018) - [j2]Shengcheng Wang, Taeyoung Kim, Zeyu Sun, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori:
Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 26(3): 531-543 (2018) - 2017
- [j1]Shengcheng Wang, Mehdi Baradaran Tahoori:
Electromigration-Aware Local-Via Allocation in Power/Ground TSVs of 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 25(10): 2881-2892 (2017) - [c8]Shengcheng Wang, Hengyang Zhao, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori:
Recovery-aware proactive TSV repair for electromigration in 3D ICs. DATE 2017: 220-225 - [c7]Shengcheng Wang, Zeyu Sun, Yuan Cheng, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori:
Leveraging recovery effect to reduce electromigration degradation in power/ground TSV. ICCAD 2017: 811-818 - 2016
- [c6]Shengcheng Wang, Ran Wang, Krishnendu Chakrabarty, Mehdi Baradaran Tahoori:
Multicast Test Architecture and Test Scheduling for Interposer-Based 2.5D ICs. ATS 2016: 86-91 - [c5]Shengcheng Wang, Mehdi Baradaran Tahoori, Krishnendu Chakrabarty:
Thermal-aware TSV repair for electromigration in 3D ICs. DATE 2016: 1291-1296 - 2015
- [c4]Shengcheng Wang, Farshad Firouzi, Fabian Oboril, Mehdi Baradaran Tahoori:
Stress-aware P/G TSV planning in 3D-ICs. ASP-DAC 2015: 94-99 - [c3]Shengcheng Wang, Mehdi Baradaran Tahoori, Krishnendu Chakrabarty:
Defect Clustering-Aware Spare-TSV Allocation for 3D ICs. ICCAD 2015: 307-314 - [c2]Shengcheng Wang, Farshad Firouzi, Fabian Oboril, Mehdi Baradaran Tahoori:
Deadspace-aware Power/Ground TSV planning in 3D floorplanning. ICICDT 2015: 1-4 - 2014
- [c1]Shengcheng Wang, Farshad Firouzi, Fabian Oboril, Mehdi Baradaran Tahoori:
P/G TSV planning for IR-drop reduction in 3D-ICs. DATE 2014: 1-6
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