"Recovery-Aware Proactive TSV Repair for Electromigration Lifetime ..."

Shengcheng Wang et al. (2018)

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DOI: 10.1109/TVLSI.2017.2775586

access: closed

type: Journal Article

metadata version: 2021-02-19

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  - https://dblp.org/rec/journals/tvlsi/WangKSTT18
Shengcheng Wang, Taeyoung Kim, Zeyu Sun, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori:
Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 26(3): 531-543 (2018)

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