"Physics-Based Compact TDDB Models for Low-k BEOL Copper Interconnects With ..."

Shaoyi Peng et al. (2018)

> Home

Details and statistics

DOI: 10.1109/TVLSI.2017.2764880

access: closed

type: Journal Article

metadata version: 2024-02-28

- view
  authority control:
- export record
  dblp key:
  - journals/tvlsi/PengZKCT18
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tvlsi/PengZKCT18
Shaoyi Peng, Han Zhou, Taeyoung Kim, Hai-Bao Chen, Sheldon X.-D. Tan:
Physics-Based Compact TDDB Models for Low-k BEOL Copper Interconnects With Time-Varying Voltage Stressing. IEEE Trans. Very Large Scale Integr. Syst. 26(2): 239-248 (2018)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.