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ORCIDKirsten Weide-Zaage
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2020 – today
- 2023
[c2]Eike Trumann
, Gia Bao Thieu, Johannes Schmechel, Kirsten Weide-Zaage, Katharina Schmidt, Dorian Hagenah, Guillermo Payá Vayá:
Radiation Tolerant Reconfigurable Hardware Architecture Design Methodology. ARC 2023: 357-360
2010 – 2019
- 2017
- [j28]Kirsten Weide-Zaage:
Simulation of packaging under harsh environment conditions (temperature, pressure, corrosion and radiation). Microelectron. Reliab. 76-77: 6-12 (2017) - 2016
- [j27]Alexandrine Guédon-Gracia, Hélène Frémont, Bernard Plano, Jean-Yves Delétage, Kirsten Weide-Zaage:
Effects of salt spray test on lead-free solder alloy. Microelectron. Reliab. 64: 242-247 (2016) - [j26]Verena Hein, Marco Erstling, Raj Sekar Sethu, Kirsten Weide-Zaage, Tianlin Bai:
Reliability evaluation of tungsten donut-via as an element of the highly robust metallization. Microelectron. Reliab. 64: 259-265 (2016) - 2015
- [j25]Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage, Bernard Plano:
Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps. Microelectron. Reliab. 55(1): 192-200 (2015) - [j24]Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont:
Dynamical IMC-growth calculation. Microelectron. Reliab. 55(9-10): 1832-1837 (2015) - [j23]Mohd Faizul Mohd Sabri, Nor Ilyana Muhd Nordin, Suhana Mohd Said, Nur Aishah Aminah Mohd Amin, Hamzah Arof, Iswadi Jauhari, Roziana Ramli, Kirsten Weide-Zaage:
Effect of thermal aging on the electrical resistivity of Fe-added SAC105 solder alloys. Microelectron. Reliab. 55(9-10): 1882-1885 (2015) - 2014
- [j22]Kirsten Weide-Zaage, J. Schlobohm, R. T. H. Rongen, F. C. Voogt, R. Roucou:
Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core. Microelectron. Reliab. 54(6-7): 1206-1211 (2014) - [j21]Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein, Christian Kovács:
Degradation behavior in upstream/downstream via test structures. Microelectron. Reliab. 54(9-10): 1724-1728 (2014) - [j20]Verena Hein, Jörg Kludt, Kirsten Weide-Zaage:
Evaluation new corner stress relief structure layout for high robust metallization. Microelectron. Reliab. 54(9-10): 1977-1981 (2014) - [j19]R. T. H. Rongen, R. Roucou, P. J. vd Wel, F. C. Voogt, F. Swartjes, Kirsten Weide-Zaage:
Reliability of Wafer Level Chip Scale Packages. Microelectron. Reliab. 54(9-10): 1988-1994 (2014) - [j18]Hélène Frémont, Jörg Kludt, Massar Wade, Kirsten Weide-Zaage, Isabelle Bord-Majek, Geneviève Duchamp:
Qualification procedure for moisture in embedded capacitors. Microelectron. Reliab. 54(9-10): 2013-2016 (2014) - [c1]Kirsten Weide-Zaage, Aymen Moujbani, Jörg Kludt:
Simulation in 3D integration and TSV. LASCAS 2014: 1-5 - 2013
- [j17]Aymen Moujbani, Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein, Lutz Meinshausen:
Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects. Microelectron. Reliab. 53(9-11): 1365-1369 (2013) - [j16]Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage, Bernard Plano:
Electro- and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads. Microelectron. Reliab. 53(9-11): 1575-1580 (2013) - [j15]Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein:
Dynamic simulation of octahedron slotted metal structures. Microelectron. Reliab. 53(9-11): 1606-1610 (2013) - 2012
- [j14]Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage:
Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers. Microelectron. Reliab. 52(9-10): 1827-1832 (2012) - [j13]Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein:
Simulation of the influence of TiAl3 layers on the thermal-electrical and mechanical behaviour of Al metallizations. Microelectron. Reliab. 52(9-10): 1987-1992 (2012) - [j12]Markus Ackermann, Verena Hein, Christian Kovács, Kirsten Weide-Zaage:
A design for robust wide metal tracks. Microelectron. Reliab. 52(9-10): 2447-2451 (2012) - [j11]Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont:
Electro- and thermo-migration induced failure mechanisms in Package on Package. Microelectron. Reliab. 52(12): 2889-2906 (2012) - 2011
- [j10]Irina Bauer, Kirsten Weide-Zaage, Lutz Meinshausen:
Influence of air gaps on the thermal-electrical-mechanical behavior of a copper metallization. Microelectron. Reliab. 51(9-11): 1587-1591 (2011) - [j9]Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont:
Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps. Microelectron. Reliab. 51(9-11): 1860-1864 (2011)
2000 – 2009
- 2009
- [j8]Joharsyah Ciptokusumo, Kirsten Weide-Zaage, Oliver Aubel:
Investigation of stress distribution in via bottom of Cu-via structures with different via form by means of submodeling. Microelectron. Reliab. 49(9-11): 1090-1095 (2009) - 2008
- [j7]Kirsten Weide-Zaage, Jiani Zhao, Joharsyah Ciptokusumo, Oliver Aubel:
Determination of migration effects in Cu-via structures with respect to process-induced stress. Microelectron. Reliab. 48(8-9): 1393-1397 (2008) - [j6]Kirsten Weide-Zaage, Farzan Kashanchi, Oliver Aubel:
Simulation of migration effects in nanoscaled copper metallizations. Microelectron. Reliab. 48(8-9): 1398-1402 (2008) - 2007
- [j5]Kirsten Weide-Zaage, David Dalleau, Yves Danto, Hélène Frémont:
Dynamic void formation in a DD-copper-structure with different metallization geometry. Microelectron. Reliab. 47(2-3): 319-325 (2007) - 2005
- [j4]Kirsten Weide-Zaage, Walter Horaud, Hélène Frémont:
Moisture diffusion in Printed Circuit Boards: Measurements and Finite- Element- Simulations. Microelectron. Reliab. 45(9-11): 1662-1667 (2005) - 2004
- [j3]Hélène Frémont, Jean-Yves Delétage, Kirsten Weide-Zaage, Yves Danto:
How to study delamination in plastic encapsulated devices. Microelectron. Reliab. 44(9-11): 1311-1316 (2004) - 2003
- [j2]David Dalleau, Kirsten Weide-Zaage, Yves Danto:
Simulation of time depending void formation in copper, aluminum and tungsten plugged via structures. Microelectron. Reliab. 43(9-11): 1821-1826 (2003) - 2001
- [j1]David Dalleau, Kirsten Weide-Zaage:
Three-Dimensional Voids Simulation in chip Metallization Structures: a Contribution to Reliability Evaluation. Microelectron. Reliab. 41(9-10): 1625-1630 (2001)
Coauthor Index
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