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"Simulation of packaging under harsh environment conditions (temperature, ..."

Kirsten Weide-Zaage (2017)

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DOI: 10.1016/J.MICROREL.2017.07.026

access: closed

type: Journal Article

metadata version: 2020-02-22

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Kirsten Weide-Zaage:
Simulation of packaging under harsh environment conditions (temperature, pressure, corrosion and radiation). Microelectron. Reliab. 76-77: 6-12 (2017)

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