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"Reliability of Wafer Level Chip Scale Packages."

R. T. H. Rongen et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.07.012

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/RongenRWVSW14
R. T. H. Rongen, R. Roucou, P. J. vd Wel, F. C. Voogt, F. Swartjes, Kirsten Weide-Zaage:
Reliability of Wafer Level Chip Scale Packages. Microelectron. Reliab. 54(9-10): 1988-1994 (2014)

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