"Electro- and thermomigration-induced IMC formation in ..."

Lutz Meinshausen et al. (2013)

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DOI: 10.1016/J.MICROREL.2013.07.038

access: closed

type: Journal Article

metadata version: 2020-02-22

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Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage, Bernard Plano:
Electro- and thermomigration-induced IMC formation in SnAg_3.0Cu_0.5 solder joints on nickel gold pads. Microelectron. Reliab. 53(9-11): 1575-1580 (2013)

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