"Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and ..."

Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage (2012)

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DOI: 10.1016/J.MICROREL.2012.06.127

access: closed

type: Journal Article

metadata version: 2020-02-22

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Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage:
Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers. Microelectron. Reliab. 52(9-10): 1827-1832 (2012)

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