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ORCIDZeyu Sun 0001
Person information
- affiliation: University of California at Riverside, CA, USA
Other persons with the same name
- Zeyu Sun — disambiguation page
- Zeyu Sun 0002
![[0000-0002-0470-4203]](https://dblp.uni-trier.de./img/orcid-mark.12x12.png "0000-0002-0470-4203")
— Luoyang Institute of Science and Technology, Key Laboratory of Intelligent IoT, China (and 1 more) - Zeyu Sun 0003 — University of Alberta, Department of Electrical and Computer Engineering, Edmonton, AB, Canada (and 1 more)
- Zeyu Sun 0004 — Peking University, Key Laboratory of High Confidence Software Technologies, HCST, MoE DCST, Beijing, China
- Zeyu Sun 0005 — University of Michigan, USA
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Journal Articles
- 2021
[j13]Liang Chen, Sheldon X.-D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang, Junfa Mao:
A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment Interconnects. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 40(2): 350-363 (2021)- 2020
- [j12]Sheldon X.-D. Tan, Zeyu Sun, Sheriff Sadiqbatcha:
Interconnect Electromigration Modeling and Analysis for Nanometer ICs: From Physics to Full-Chip. IPSJ Trans. Syst. LSI Des. Methodol. 13: 42-55 (2020) - [j11]Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan:
Accelerating Electromigration Aging: Fast Failure Detection for Nanometer ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 39(4): 885-894 (2020) - [j10]Liang Chen, Sheldon X.-D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang, Junfa Mao:
Fast Analytic Electromigration Analysis for General Multisegment Interconnect Wires. IEEE Trans. Very Large Scale Integr. Syst. 28(2): 421-432 (2020) - 2019
- [j9]Chase Cook, Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan:
Reliability based hardware Trojan design using physics-based electromigration models. Integr. 66: 9-15 (2019) - [j8]Han Zhou, Zeyu Sun, Sheriff Sadiqbatcha, Naehyuck Chang, Sheldon X.-D. Tan:
EM-Aware and Lifetime-Constrained Optimization for Multisegment Power Grid Networks. IEEE Trans. Very Large Scale Integr. Syst. 27(4): 940-953 (2019) - [j7]Zeyu Sun, Sheriff Sadiqbatcha, Hengyang Zhao, Sheldon X.-D. Tan:
Saturation-Volume Estimation for Multisegment Copper Interconnect Wires. IEEE Trans. Very Large Scale Integr. Syst. 27(7): 1666-1674 (2019) - 2018
- [j6]Sheldon X.-D. Tan, Hussam Amrouch, Taeyoung Kim, Zeyu Sun, Chase Cook, Jörg Henkel:
Recent advances in EM and BTI induced reliability modeling, analysis and optimization (invited). Integr. 60: 132-152 (2018) - [j5]Taeyoung Kim, Sheldon X.-D. Tan, Chase Cook, Zeyu Sun:
Detection of counterfeited ICs via on-chip sensor and post-fabrication authentication policy. Integr. 63: 31-40 (2018) - [j4]Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Chase Cook, Sheldon X.-D. Tan:
Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 37(12): 3137-3150 (2018) - [j3]Shengcheng Wang, Taeyoung Kim, Zeyu Sun, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori:
Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 26(3): 531-543 (2018) - [j2]Chase Cook, Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Sheldon X.-D. Tan:
Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method. IEEE Trans. Very Large Scale Integr. Syst. 26(5): 969-980 (2018) - 2017
- [j1]Taeyoung Kim, Zeyu Sun, Hai-Bao Chen, Hai Wang, Sheldon X.-D. Tan:
Energy and Lifetime Optimizations for Dark Silicon Manycore Microprocessor Considering Both Hard and Soft Errors. IEEE Trans. Very Large Scale Integr. Syst. 25(9): 2561-2574 (2017)
Conference and Workshop Papers
- 2020
- [c14]Han Zhou, Shuyuan Yu, Zeyu Sun, Sheldon X.-D. Tan:
Reliable Power Grid Network Design Framework Considering EM Immortalities for Multi-Segment Wires. ASP-DAC 2020: 74-79 - [c13]Wentian Jin, Sheriff Sadiqbatcha, Zeyu Sun, Han Zhou, Sheldon X.-D. Tan:
EM-GAN: Data-Driven Fast Stress Analysis for Multi-Segment Interconnects. ICCD 2020: 296-303 - 2019
- [c12]Zeyu Sun, Taeyoung Kim, Marcus Chow, Shaoyi Peng, Han Zhou, Hyoseung Kim, Daniel Wong, Sheldon X.-D. Tan:
Long-Term Reliability Management For Multitasking GPGPUs. SMACD 2019: 213-216 - [c11]Zeyu Sun, Han Zhou, Sheldon X.-D. Tan:
Dynamic Reliability Management for Multi-Core Processor Based on Deep Reinforcement Learning. SMACD 2019: 217-220 - 2018
- [c10]Han Zhou, Yijing Sun, Zeyu Sun, Hengyang Zhao, Sheldon X.-D. Tan:
Electromigration-lifetime constrained power grid optimization considering multi-segment interconnect wires. ASP-DAC 2018: 399-404 - [c9]Zeyu Sun, Sheriff Sadiqbatcha, Hengyang Zhao, Sheldon X.-D. Tan:
Accelerating electromigration aging for fast failure detection for nanometer ICs. ASP-DAC 2018: 623-630 - [c8]Chase Cook, Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan:
Reliability Based Hardware Trojan Design Using Physics-Based Electromigration Models. SMACD 2018: 5-8 - [c7]Sheriff Sadiqbatcha, Chase Cook, Zeyu Sun, Sheldon X.-D. Tan:
Accelerating Electromigration Wear-Out Effects Based on Configurable Sink-Structured Wires. SMACD 2018: 21-24 - 2017
- [c6]Jiangtao Peng, Hai-Bao Chen, Hengyang Zhao, Zeyu Sun, Sheldon X.-D. Tan:
Dynamic temperature-aware reliability modeling for multi-branch interconnect trees. ASICON 2017: 92-95 - [c5]Shengcheng Wang, Zeyu Sun, Yuan Cheng, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori:
Leveraging recovery effect to reduce electromigration degradation in power/ground TSV. ICCAD 2017: 811-818 - 2016
- [c4]Taeyoung Kim, Zeyu Sun, Chase Cook, Hengyang Zhao, Ruiwen Li, Daniel Wong, Sheldon X.-D. Tan:
Invited - Cross-layer modeling and optimization for electromigration induced reliability. DAC 2016: 30:1-30:6 - [c3]Taeyoung Kim, Zeyu Sun, Chase Cook, Jagadeesh Gaddipati, Hai Wang, Hai-Bao Chen, Sheldon X.-D. Tan:
Dynamic reliability management for near-threshold dark silicon processors. ICCAD 2016: 70 - [c2]Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Taeyoung Kim, Xin Huang, Sheldon X.-D. Tan:
Voltage-based electromigration immortality check for general multi-branch interconnects. ICCAD 2016: 113 - [c1]Chase Cook, Zeyu Sun, Taeyoung Kim, Sheldon X.-D. Tan:
Finite difference method for electromigration analysis of multi-branch interconnects. SMACD 2016: 1-4
Editorship
- 2019
- [e1]Sheldon X.-D. Tan, Mehdi Baradaran Tahoori, Taeyoung Kim, Shengcheng Wang, Zeyu Sun, Saman Kiamehr:
Long-Term Reliability of Nanometer VLSI Systems, Modeling, Analysis and Optimization. Springer 2019, ISBN 978-3-030-26171-9
Coauthor Index
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