- 2024
- Siting Liu, Jiaxi Jiang, Zhuolun He, Ziyi Wang, Yibo Lin, Bei Yu, Martin D. F. Wong:
Routing-aware Legal Hybrid Bonding Terminal Assignment for 3D Face-to-Face Stacked ICs. ISPD 2024: 75-82 - Keh-Jeng Chang:
PANEL: EDA Challenges at Advanced Technology Nodes C. ISPD 2024: 73 - Yao-Wen Chang:
Physical Design Challenges in Modern Heterogeneous Integration. ISPD 2024: 125-134 - Jim Chang:
3Dblox: Unleash the Ultimate 3DIC Design Productivity. ISPD 2024: 215 - Erick Chao:
AI for EDA/Physical Design: Driving the AI Revolution: The Crucial Role of 3D-IC. ISPD 2024: 113 - Tung-Chieh Chen:
Introduction to the Panel on EDA Challenges at Advanced Technology Nodes. ISPD 2024: 61 - Hung-Ming Chen:
Enabling System Design in 3D Integration: Technologies and Methodologies. ISPD 2024: 217 - Yen-Yu Chen, Hao-Yu Wu, Iris Hui-Ru Jiang, Cheng-Hong Tsai, Chien-Cheng Wu:
Slack Redistributed Register Clustering with Mixed-Driving Strength Multi-bit Flip-Flops. ISPD 2024: 21-29 - Jun-Ho Choy, Stéphane Moreau, Catherine Brunet-Manquat, Valeriy Sukharev, Armen Kteyan:
Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects. ISPD 2024: 85-90 - Jason Cong:
Scheduling and Physical Design. ISPD 2024: 219-225 - Zi-Hao Guo, Ting-Chi Wang:
SMT-Based Layout Synthesis Approaches for Quantum Circuits. ISPD 2024: 235-243 - Zhuolun He, Bei Yu:
Large Language Models for EDA: Future or Mirage? ISPD 2024: 65-66 - Chia-Tung Ho, Ajay Chandna, David Guan, Alvin Ho, Minsoo Kim, Yaguang Li, Haoxing Ren:
Novel Transformer Model Based Clustering Method for Standard Cell Design Automation. ISPD 2024: 195-203 - Hao-Hsiang Hsiao, Yi-Chen Lu, Pruek Vanna-Iampikul, Sung Kyu Lim:
FastTuner: Transferable Physical Design Parameter Optimization using Fast Reinforcement Learning. ISPD 2024: 93-101 - Teng-Ping Huang, Shao-Yun Fang:
Practical Mixed-Cell-Height Legalization Considering Vertical Cell Abutment Constraint. ISPD 2024: 151-159 - Tsung-Wei Huang, Boyang Zhang, Dian-Lun Lin, Cheng-Hsiang Chiu:
Parallel and Heterogeneous Timing Analysis: Partition, Algorithm, and System. ISPD 2024: 51-59 - Alex Hung:
Introduction of 3D IC Thermal Analysis Flow. ISPD 2024: 213 - Goeran Jerke:
Physical Design Challenges for Automotive ASICs. ISPD 2024: 265 - Andrew B. Kahng:
Panel Statement: EDA Needs at Advanced Technology Nodes. ISPD 2024: 63 - Andrew B. Kahng:
Solvers, Engines, Tools and Flows: The Next Wave for AI/ML in Physical Design. ISPD 2024: 117-124 - Suwan Kim, Hyunbum Park, Kyeonghyeon Baek, Kyumyung Choi, Taewhan Kim:
Methodology of Resolving Design Rule Checking Violations Coupled with Fully Compatible Prediction Model. ISPD 2024: 103-111 - Rob Knoth:
Solving the Physical Challenges for the Next Generation of Safety Critical & High Reliability Systems. ISPD 2024: 267 - Andreas Krinke, Robert Fischbach, Jens Lienig:
Layout Verification Using Open-Source Software. ISPD 2024: 137-142 - Wang-Tyng Lay:
Unified 3D-IC Multi-Chiplet System Design Solution. ISPD 2024: 83 - Wuxi Li, Yuji Kukimoto, Grégory Servel, Ismail Bustany, Mehrdad E. Dehkordi:
Calibration-Based Differentiable Timing Optimization in Non-linear Global Placement. ISPD 2024: 31-39 - Bor-Sung Liang:
Computing Architecture for Large-Language Models (LLMs) and Large Multimodal Models (LMMs). ISPD 2024: 233-234 - Rongjian Liang, Anthony Agnesina, Wen-Hao Liu, Haoxing Ren:
GPU/ML-Enhanced Large Scale Global Routing Contest. ISPD 2024: 269-274 - Rongjian Liang, Anthony Agnesina, Haoxing Ren:
MedPart: A Multi-Level Evolutionary Differentiable Hypergraph Partitioner. ISPD 2024: 3-11 - Guang-Wan Liao:
PANEL: EDA Challenges at Advanced Technology Nodes B. ISPD 2024: 69 - Chung-Wei Lin:
Design Automation Challenges for Automotive Systems. ISPD 2024: 263