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2010 – 2019
- 2017
[j5]Moongon Jung
, Taigon Song, Yarui Peng, Sung Kyu Lim:
Design Methodologies for Low-Power 3-D ICs With Advanced Tier Partitioning. IEEE Trans. Very Large Scale Integr. Syst. 25(7): 2109-2117 (2017)- 2015
- [j4]Daehyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim:
Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory). IEEE Trans. Computers 64(1): 112-125 (2015) - 2014
- [j3]Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim:
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC. Commun. ACM 57(1): 107-115 (2014) - [c11]Moongon Jung, Taigon Song, Yang Wan, Yarui Peng, Sung Kyu Lim:
On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective. DAC 2014: 4:1-4:6 - 2013
- [j2]Moongon Jung, David Z. Pan, Sung Kyu Lim:
Chip/Package Mechanical Stress Impact on 3-D IC Reliability and Mobility Variations. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32(11): 1694-1707 (2013) - [c10]Krit Athikulwongse, Dae Hyun Kim, Moongon Jung, Sung Kyu Lim:
Block-level designs of die-to-wafer bonded 3D ICs and their design quality tradeoffs. ASP-DAC 2013: 687-692 - [c9]Moongon Jung, Taigon Song, Yang Wan, Young-Joon Lee, Debabrata Mohapatra, Hong Wang, Greg Taylor, Devang Jariwala, Vijay Pitchumani, Patrick Morrow, Clair Webb, Paul Fischer, Sung Kyu Lim:
How to reduce power in 3D IC designs: A case study with OpenSPARC T2 core. CICC 2013: 1-4 - [c8]Chun Zhang, Moongon Jung, Sung Kyu Lim, Yiyu Shi:
Novel crack sensor for TSV-based 3D integrated circuits: design and deployment perspectives. ICCAD 2013: 371-378 - 2012
- [j1]Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim:
TSV Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization for 3-D IC. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 31(8): 1194-1207 (2012) - [c7]David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Moongon Jung, Joydeep Mitra, Jiwoo Pak, Mohit Pathak, Jae-Seok Yang:
Design for manufacturability and reliability for TSV-based 3D ICs. ASP-DAC 2012: 750-755 - [c6]Moongon Jung, David Z. Pan, Sung Kyu Lim:
Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs. DAC 2012: 317-326 - [c5]Dae Hyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim:
3D-MAPS: 3D Massively parallel processor with stacked memory. ISSCC 2012: 188-190 - 2011
- [c4]Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim:
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC. DAC 2011: 188-193 - [c3]Moongon Jung, Xi Liu, Suresh K. Sitaraman, David Z. Pan, Sung Kyu Lim:
Full-chip through-silicon-via interfacial crack analysis and optimization for 3D IC. ICCAD 2011: 563-570 - 2010
- [c2]Moongon Jung, Sung Kyu Lim:
A study of IR-drop noise issues in 3D ICs with through-silicon-vias. 3DIC 2010: 1-7 - [c1]Michael B. Healy, Krit Athikulwongse, Rohan Goel, Mohammad M. Hossain, Dae Hyun Kim, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Moongon Jung, Brian Ouellette, Mohit Pathak, Hemant Sane, Guanhao Shen, Dong Hyuk Woo, Xin Zhao, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim:
Design and analysis of 3D-MAPS: A many-core 3D processor with stacked memory. CICC 2010: 1-4
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