"Full-chip through-silicon-via interfacial crack analysis and optimization ..."

Moongon Jung et al. (2011)

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DOI: 10.1109/ICCAD.2011.6105386

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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Moongon Jung, Xi Liu, Suresh K. Sitaraman, David Z. Pan, Sung Kyu Lim:
Full-chip through-silicon-via interfacial crack analysis and optimization for 3D IC. ICCAD 2011: 563-570

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