"Novel crack sensor for TSV-based 3D integrated circuits: design and ..."

Chun Zhang et al. (2013)

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DOI: 10.1109/ICCAD.2013.6691145

access: closed

type: Conference or Workshop Paper

metadata version: 2022-12-13

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Chun Zhang, Moongon Jung, Sung Kyu Lim, Yiyu Shi:
Novel crack sensor for TSV-based 3D integrated circuits: design and deployment perspectives. ICCAD 2013: 371-378

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