"On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles ..."

Moongon Jung et al. (2014)

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DOI: 10.1145/2593069.2593167

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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Moongon Jung, Taigon Song, Yang Wan, Yarui Peng, Sung Kyu Lim:
On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective. DAC 2014: 4:1-4:6

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