"TSV stress-aware full-chip mechanical reliability analysis and ..."

Moongon Jung et al. (2011)

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DOI: 10.1145/2024724.2024767

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim:
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC. DAC 2011: 188-193

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