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Journal Articles
- 2024
[j4]Nesara Eranna Bethur
, Anthony Agnesina, Moritz Brunion, Alberto García Ortiz, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Matheus A. Cavalcante, Samuel Riedel, Luca Benini, Sung Kyu Lim:
Hier-3D: A Methodology for Physical Hierarchy Exploration of 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 43(7): 1957-1970 (2024)- [j3]Yen-Hsiang Huang, Sai Pentapati, Anthony Agnesina, Moritz Brunion, Sung Kyu Lim:
On Legalization of Die Bonding Bumps and Pads for 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 43(9): 2741-2754 (2024) - 2023
- [j2]Sankatali Venkateswarlu, Subrat Mishra, Herman Oprins, Bjorn Vermeersch, Moritz Brunion, Jun-Han Han, Mircea R. Stan, Dwaipayan Biswas, Pieter Weckx, Francky Catthoor:
Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC. IEEE Trans. Very Large Scale Integr. Syst. 31(12): 1896-1904 (2023) - 2022
- [j1]Sankatali Venkateswarlu, Subrat Mishra, Herman Oprins, Bjorn Vermeersch, Moritz Brunion, Jun-Han Han, Mircea R. Stan, Pieter Weckx, Francky Catthoor:
Thermal Performance Analysis of Mempool RISC-V Multicore SoC. IEEE Trans. Very Large Scale Integr. Syst. 30(11): 1668-1676 (2022)
Conference and Workshop Papers
- 2024
- [c11]Subrat Mishra, Bjorn Vermeersch, Sankatali Venkateswarlu, Halil Kukner, A. Sharma, G. Mirabeli, Fabian M. Bufler, Moritz Brunion, Dawit Burusie Abdi, Herman Oprins, Dwaipayan Biswas, Odysseas Zografos, Francky Catthoor, Pieter Weckx, Geert Hellings, James Myers, Julien Ryckaert:
Thermal Performance Evaluation of Multi-Core SOCs Using Power-Thermal Co-Simulation. IRPS 2024: 1-6 - [c10]Nitish Kumar, Sankatali Venkateswarlu, Yukai Chen, Moritz Brunion, Subrat Mishra, Ankur Gupta, Pushpapraj Singh, Francky Catthoor, James Myers, Julien Ryckaert, Dwaipayan Biswas:
Thermal Analysis of High-Performance Server SoCs from FinFET to Nanosheet Technologies. IRPS 2024: 8 - [c9]Sudipta Das, Samuel Riedel, Marco Bertuletti, Luca Benini, Moritz Brunion, Julien Ryckaert, James Myers, Dwaipayan Biswas, Dragomir Milojevic:
3D Partitioning with Pipeline Optimization for Low-Latency Memory Access in Many-Core SoCs. ISCAS 2024: 1-5 - [c8]S. Mishra, Bjorn Vermeersch, Sankatali Venkateswarlu, Halil Kukner, Gioele Mirabelli, Fabian M. Bufler, Moritz Brunion, Dawit Burusie Abdi, Herman Oprins, Dwaipayan Biswas, Odysseas Zografos, Francky Catthoor, Pieter Weckx, Geert Hellings, James Myers, Julien Ryckaert:
Thermal Considerations for Block-Level PPA Assessment in Angstrom Era: A Comparison Study of Nanosheet FETs (A10) & Complementary FETs (A5). VLSI Technology and Circuits 2024: 1-2 - [c7]Yun Zhou, S. C. Song, Halil Kükner, Giuliano Sisto, Sheng Yang, Anita Farokhnejad, Mohamed Naeim, Moritz Brunion, Ji-Yung Lin, Odysseas Zografos, Pieter Weckx, Shashank Ekbote, Nick Stevens-Yu, David Greenlaw, Steve Molloy, Geert Hellings, Julien Ryckaert:
Backside Power Delivery in High Density and High Performance Context: IR-Drop and Block-Level Power-Performance-Area Benefits. VLSI Technology and Circuits 2024: 1-2 - 2023
- [c6]Mohamed Naeim, Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser, Giuliano Sisto, Moritz Brunion, Rongmei Chen, Geert Van der Plas, Eric Beyne, Dragomir Milojevic:
Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs. 3DIC 2023: 1-4 - [c5]Subrat Mishra, Sankatali Venkateswarlu, Bjorn Vermeersch, Moritz Brunion, Melina Lofrano, Dawit Burusie Abdi, Herman Oprins, Dwaipayan Biswas, Odysseas Zografos, Gaspard Hiblot, Geert Van der Plas, Pieter Weckx, Geert Hellings, James Myers, Francky Catthoor, Julien Ryckaert:
Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs). IRPS 2023: 1-7 - [c4]Sai Pentapati, Anthony Agnesina, Moritz Brunion, Yen-Hsiang Huang, Sung Kyu Lim:
On Legalization of Die Bonding Bumps and Pads for 3D ICs. ISPD 2023: 62-70 - 2022
- [c3]Matheus A. Cavalcante, Anthony Agnesina, Samuel Riedel, Moritz Brunion, Alberto García-Ortiz, Dragomir Milojevic, Francky Catthoor, Sung Kyu Lim, Luca Benini:
MemPool-3D: Boosting Performance and Efficiency of Shared-L1 Memory Many-Core Clusters with 3D Integration. DATE 2022: 394-399 - [c2]Anthony Agnesina, Moritz Brunion, Alberto García Ortiz, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Matheus A. Cavalcante, Samuel Riedel, Luca Benini, Sung Kyu Lim:
Hier-3D: A Hierarchical Physical Design Methodology for Face-to-Face-Bonded 3D ICs. ISLPED 2022: 15:1-15:6 - 2021
- [c1]Anthony Agnesina, Moritz Brunion, Jinwoo Kim, Alberto García Ortiz, Dragomir Milojevic, Francky Catthoor, Manu Perumkunnil, Sung Kyu Lim:
Power, Performance, Area and Cost Analysis of Memory-on-Logic Face-to-Face Bonded 3D Processor Designs. ISLPED 2021: 1-6
Informal and Other Publications
- 2021
- [i1]Matheus A. Cavalcante, Anthony Agnesina, Samuel Riedel, Moritz Brunion, Alberto García-Ortiz, Dragomir Milojevic, Francky Catthoor, Sung Kyu Lim, Luca Benini:
MemPool-3D: Boosting Performance and Efficiency of Shared-L1 Memory Many-Core Clusters with 3D Integration. CoRR abs/2112.01168 (2021)
Coauthor Index
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