"Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding ..."

Mohamed Naeim et al. (2023)

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DOI: 10.1109/3DIC57175.2023.10155075

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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Mohamed Naeim, Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser, Giuliano Sisto, Moritz Brunion, Rongmei Chen, Geert Van der Plas, Eric Beyne, Dragomir Milojevic:
Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs. 3DIC 2023: 1-4

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