"Hier-3D: A Hierarchical Physical Design Methodology for ..."

Anthony Agnesina et al. (2022)

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DOI: 10.1145/3531437.3539702

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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  - conf/islped/AgnesinaBOCMKCR22
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  - https://dblp.org/rec/conf/islped/AgnesinaBOCMKCR22
Anthony Agnesina, Moritz Brunion, Alberto García Ortiz, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Matheus A. Cavalcante, Samuel Riedel, Luca Benini, Sung Kyu Lim:
Hier-3D: A Hierarchical Physical Design Methodology for Face-to-Face-Bonded 3D ICs. ISLPED 2022: 15:1-15:6

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