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ORCIDLing Li 0013
Person information
- affiliation: Chinese Academy of Sciences, Institute of Microelectronics, State Key Laboratory of Fabrication Technologies for Integrated Circuits, Beijing, China
- affiliation: University of Chinese Academy of Sciences, School of Integrated Circuits, Beijing, China
- affiliation (PhD 2007): TU Wien, Vienna, Austria
Other persons with the same name
- Ling Li — disambiguation page
- Ling Li 0001
![[0000-0001-8877-9052]](https://dblp.uni-trier.de./img/orcid-mark.12x12.png "0000-0001-8877-9052")
— Institute of Software, Chinese Academy of Sciences, China (and 1 more) - Ling Li 0002 — Macquarie University, Australian Institute of Health Innovation, Sydney, Australia
- Ling Li 0003 — University of Queensland, School of Civil Engineering, Brisbane, QLD, Australia (and 1 more)
- Ling Li 0004 — Central South University, Department of Biomedical Engineering, School of Geosciences and Info-Physics, Changsha, China
- Ling Li 0005 — Tianjin University, College of Management and Economics, China
- Ling Li 0006 — Curtin University, Department of Computing, Perth, WA, Australia (and 1 more)
- Ling Li 0007 — Shanghai Jiao Tong University, Soft Robotics and Biodesign Lab, China (and 1 more)
- Ling Li 0008 — Old Dominion University, Norfolk, Virginia, USA
- Ling Li 0009 — Iowa State University, Department of Genetics, Ames, USA
- Ling Li 0010 — City University of London, School of Science and Technology, UK (and 1 more)
- Ling Li 0011 — Shanghai Lixin University of Accounting and Finance, School of Statistics and Mathematics, China (and 2 more)
- Ling Li 0012 — King's College London, UK (and 1 more)
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2020 – today
- 2025
[j6]Zhenjie Yao, Ziyi Hu, Panpan Lai, Fengling Qin, Wenrui Wang, Zhicheng Wu, Lingfei Wang, Hua Shao, Yongfu Li, Zhiqiang Li, Zhongming Liu, Junjie Li, Rui Chen, Ling Li:
Etching process prediction based on cascade recurrent neural network. Eng. Appl. Artif. Intell. 139: 109590 (2025)- 2024
- [j5]Yang Li, Wei Wang, Ming Wang, Chunmeng Dou, Zhengyu Ma, Huihui Zhou, Peng Zhang, Nicola Lepri, Xumeng Zhang, Qing Luo, Xiaoxin Xu, Guanhua Yang, Feng Zhang, Ling Li, Daniele Ielmini, Ming Liu:
Binary-Stochasticity-Enabled Highly Efficient Neuromorphic Deep Learning Achieves Better-than-Software Accuracy. Adv. Intell. Syst. 6(1) (2024) - [j4]Zhuoyu Dai, Feibin Xiang, Xiangqu Fu, Yifan He, Wenyu Sun, Yongpan Liu, Guanhua Yang, Feng Zhang, Jinshan Yue, Ling Li:
A Multichiplet Computing-in-Memory Architecture Exploration Framework Based on Various CIM Devices. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 43(12): 4613-4625 (2024) - [c11]Zeyu Guo, Jinshan Yue, Shengzhe Yan, Zhuoyu Dai, Xiangqu Fu, Zhaori Cong, Zening Niu, Ke Hu, Lihua Xu, Jiawei Wang, Lingfei Wang, Guanhua Yang, Di Geng, Ling Li:
IG-CRM: Area/Energy-Efficient IGZO-Based Circuits and Architecture Design for Reconfigurable CIM/CAM Applications. DAC 2024: 57:1-57:6 - [c10]Menggan Liu, Zhi Li, Wendong Lu, Kaifei Chen, Jiebin Niu, Fuxi Liao, Zijing Wu, Congyan Lu, Weizeng Li, Di Geng, Nianduan Lu, Chunmeng Dou, Guanhua Yang, Ling Li, Ming Liu:
First Demonstration of Monolithic Three-Dimensional Integration of Ultra-High Density Hybrid IGZO/Si SRAM and IGZO 2T0C DRAM Achieving Record-Low Latency (5000s). VLSI Technology and Circuits 2024: 1-2 - [c9]Jiayi Wang, Ziheng Bai, Kuo Zhang, Zhicheng Wu, Di Geng, Yang Xu, Nannan You, Yuxuan Li, Guanhua Yang, Ling Li, Shengkai Wang, Ming Liu:
Ge-doped In2O3: First Demonstration of Utlizing Ge as Oxygen Vacancy Consumer to Break the Mobility/Reliability Tradeoff for High Performance Oxide TFTs. VLSI Technology and Circuits 2024: 1-2 - 2023
- [c8]Yanqin Zhang, Yifan Xie, Shuaidi Zhang, Lingfei Wang, Mengmeng Li, Ling Li:
Optimization of Electrical Performance of aingaZnO Thin-Film Transistors by Interfacial Modification and Passivation. ICTA 2023: 37-38 - [c7]Tiancheng Gong, Lihua Xu, Wei Wei, Pengfei Jiang, Peng Yuan, Bowen Nie, Yuanquan Huang, Yuan Wang, Yang Yang, Jianfeng Gao, Junfeng Li, Jun Luo, Lingfei Wang, Jianguo Yang, Qing Luo, Ling Li, Steve S. Chung, Ming Liu:
First Demonstration of a Design Methodology for Highly Reliable Operation at High Temperature on 128kb 1T1C FeRAM Chip. VLSI Technology and Circuits 2023: 1-2 - [i2]Yang Li, Wei Wang, Ming Wang, Chunmeng Dou, Zhengyu Ma, Huihui Zhou, Peng Zhang, Nicola Lepri, Xumeng Zhang, Qing Luo, Xiaoxin Xu, Guanhua Yang, Feng Zhang, Ling Li, Daniele Ielmini, Ming Liu:
Binary stochasticity enabled highly efficient neuromorphic deep learning achieves better-than-software accuracy. CoRR abs/2304.12866 (2023) - 2022
- [c6]Kailiang Huang, Xinlv Duan, Junxiao Feng, Ying Sun, Congyan Lu, Chuanke Chen, Guangfan Jiao, Xinpeng Lin, Jinhai Shao, Shihui Yin, Jiazhen Sheng, Zhaogui Wang, Wenqiang Zhang, Xichen Chuai, Jiebin Niu, Wenwu Wang, Ying Wu, Weiliang Jing, Zhengbo Wang, Jeffrey Xu, Guanhua Yang, Di Geng, Ling Li, Ming Liu:
Vertical Channel-All-Around (CAA) IGZO FET under 50 nm CD with High Read Current of 32.8 μA/μm (Vth + 1 V), Well-performed Thermal Stability up to 120 ℃ for Low Latency, High-density 2T0C 3D DRAM Application. VLSI Technology and Circuits 2022: 296-297 - [c5]Kaifei Chen, Jiebin Niu, Guanhua Yang, Menggan Liu, Wendong Lu, Fuxi Liao, Kailiang Huang, XinLv Duan, Congyan Lu, Jiawei Wang, Lingfei Wang, Mengmeng Li, Di Geng, Chao Zhao, Guilei Wang, Nianduan Lu, Ling Li, Ming Liu:
Scaling Dual-Gate Ultra-thin a-IGZO FET to 30 nm Channel Length with Record-high Gm, max of 559 µS/µm at VDS=1 V, Record-low DIBL of 10 mV/V and Nearly Ideal SS of 63 mV/dec. VLSI Technology and Circuits 2022: 298-299 - [c4]Jingrui Guo, Ying Sun, Lingfei Wang, Xinlv Duan, Kailiang Huang, Zhaogui Wang, Junxiao Feng, Qian Chen, Shijie Huang, Lihua Xu, Di Geng, Guangfan Jiao, Shihui Yin, Zhengbo Wang, Weiliang Jing, Ling Li, Ming Liu:
Compact Modeling of IGZO-based CAA-FETs with Time-zero-instability and BTI Impact on Device and Capacitor-less DRAM Retention Reliability. VLSI Technology and Circuits 2022: 300-301 - [c3]Yuan Qin, Congyan Lu, Zhaoan Yu, Zhihong Yao, Feihong Wu, Danian Dong, Xiaolong Zhao, Guangwei Xu, Yuhao Zhang, Shibing Long, Ling Li, Ming Liu:
First Demonstration of High-Sensitivity (NEP 1fW1/2) Back-Illuminated Active-Matrix Deep UV Image Sensor by Monolithic Integration of Ga2O3 Photodetectors and Oxide Thin-Film-Transistors. VLSI Technology and Circuits 2022: 345-346
2010 – 2019
- 2019
- [j3]Linan Li, Wenqiang Ba, Wei Wang, Ling Li, Guangwei Xu, Lingfei Wang, Zhuoyu Ji, Congyan Lu, Writam Banerjee:
A physical model for dual gate a-InGaZnO thin film transistors based on multiple trapping and release mechanism. Microelectron. J. 86: 1-6 (2019) - [j2]Yiming Wang, Yun Li, Haihua Shen, Dongyu Fan, Wei Wang, Ling Li, Qi Liu, Feng Zhang, Xinghua Wang, Meng-Fan Chang, Ming Liu:
A Few-Step and Low-Cost Memristor Logic Based on MIG Logic for Frequent-Off Instant-On Circuits in IoT Applications. IEEE Trans. Circuits Syst. II Express Briefs 66-II(4): 662-666 (2019) - [c2]Qiang Huo, Zhenhua Wu, Feng Zhang, Ling Li:
A Modeling Approach for 7nm Technology Node Area-Consuming Circuit Optimization and Beyond. SMACD 2019: 93-96 - [i1]Qiang Huo, Zhenhua Wu, Weixing Huang, Xingsheng Wang, Geyu Tang, Jiaxin Yao, Yongpan Liu, Feng Zhang, Ling Li, Ming Liu:
A Novel General Compact Model Approach for 7nm Technology Node Circuit Optimization from Device Perspective and Beyond. CoRR abs/1905.11207 (2019) - 2018
- [c1]Ying Meng, Jiawei Wang, Anjie Ming, Yinghui Wang, Xuewen Shi, Molin Li, Jing Zhang, Weibing Wang, Ling Li:
A Novel PbS/n-IGZO Thin-Film Nano-Photodetector with High Responsivity and High Photo-to-Dark Current Ratio. NEMS 2018: 131-134
2000 – 2009
- 2006
- [j1]Ling Li, Shibing Long, Congshun Wang, Wengang Wu, Yilong Hao, Ming Liu:
Modeling and simulation development of electron beam resist based on cellular automata. Microelectron. J. 37(4): 317-320 (2006)
Coauthor Index
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