"First Demonstration of a Design Methodology for Highly Reliable Operation ..."

Tiancheng Gong et al. (2023)

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DOI: 10.23919/VLSITECHNOLOGYANDCIR57934.2023.10185402

access: closed

type: Conference or Workshop Paper

metadata version: 2025-02-11

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Tiancheng Gong, Lihua Xu, Wei Wei, Pengfei Jiang, Peng Yuan, Bowen Nie, Yuanquan Huang, Yuan Wang, Yang Yang, Jianfeng Gao, Junfeng Li, Jun Luo, Lingfei Wang, Jianguo Yang, Qing Luo, Ling Li, Steve S. Chung, Ming Liu:
First Demonstration of a Design Methodology for Highly Reliable Operation at High Temperature on 128kb 1T1C FeRAM Chip. VLSI Technology and Circuits 2023: 1-2

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