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Journal Articles
- 2023
[j10]Sankatali Venkateswarlu
, Subrat Mishra, Herman Oprins, Bjorn Vermeersch, Moritz Brunion, Jun-Han Han, Mircea R. Stan, Dwaipayan Biswas, Pieter Weckx, Francky Catthoor:
Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC. IEEE Trans. Very Large Scale Integr. Syst. 31(12): 1896-1904 (2023)- 2022
- [j9]Sankatali Venkateswarlu, Subrat Mishra, Herman Oprins, Bjorn Vermeersch, Moritz Brunion, Jun-Han Han, Mircea R. Stan, Pieter Weckx, Francky Catthoor:
Thermal Performance Analysis of Mempool RISC-V Multicore SoC. IEEE Trans. Very Large Scale Integr. Syst. 30(11): 1668-1676 (2022) - 2017
- [j8]Jesús Carrete, Bjorn Vermeersch, Ankita Katre, Ambroise van Roekeghem, Tao Wang, Georg K. H. Madsen, Natalio Mingo:
almaBTE : A solver of the space-time dependent Boltzmann transport equation for phonons in structured materials. Comput. Phys. Commun. 220: 351-362 (2017) - 2011
- [j7]Marcin Janicki, Jedrzej Banaszczyk, Bjorn Vermeersch, Gilbert De Mey, Andrzej Napieralski:
Generation of reduced dynamic thermal models of electronic systems from time constant spectra of transient temperature responses. Microelectron. Reliab. 51(8): 1351-1355 (2011) - 2009
- [j6]Marcin Janicki, Jedrzej Banaszczyk, Gilbert De Mey, Marek Kaminski, Bjorn Vermeersch, Andrzej Napieralski:
Dynamic thermal modelling of a power integrated circuit with the application of structure functions. Microelectron. J. 40(7): 1135-1140 (2009) - [j5]Bjorn Vermeersch, Gilbert De Mey:
Dynamic electrothermal simulation of integrated resistors at device level. Microelectron. J. 40(9): 1411-1416 (2009) - 2008
- [j4]Bjorn Vermeersch, Gilbert De Mey:
Dependency of thermal spreading resistance on convective heat transfer coefficient. Microelectron. Reliab. 48(5): 734-738 (2008) - 2007
- [j3]Bjorn Vermeersch, Gilbert De Mey:
Influence of substrate thickness on thermal impedance of microelectronic structures. Microelectron. Reliab. 47(2-3): 437-443 (2007) - [j2]Bjorn Vermeersch, Gilbert De Mey:
Influence of thermal contact resistance on thermal impedance of microelectronic structures. Microelectron. Reliab. 47(8): 1233-1238 (2007) - 2006
- [j1]Bjorn Vermeersch, Gilbert De Mey:
Thermal impedance plots of micro-scaled devices. Microelectron. Reliab. 46(1): 174-177 (2006)
Conference and Workshop Papers
- 2024
- [c9]Subrat Mishra, Bjorn Vermeersch, Sankatali Venkateswarlu, Halil Kukner, A. Sharma, G. Mirabeli, Fabian M. Bufler, Moritz Brunion, Dawit Burusie Abdi, Herman Oprins, Dwaipayan Biswas, Odysseas Zografos, Francky Catthoor, Pieter Weckx, Geert Hellings, James Myers, Julien Ryckaert:
Thermal Performance Evaluation of Multi-Core SOCs Using Power-Thermal Co-Simulation. IRPS 2024: 1-6 - [c8]S. Mishra, Bjorn Vermeersch, Sankatali Venkateswarlu, Halil Kukner, Gioele Mirabelli, Fabian M. Bufler, Moritz Brunion, Dawit Burusie Abdi, Herman Oprins, D. Biswas, Odysseas Zografos, Francky Catthoor, Pieter Weckx, Geert Hellings, James Myers, Julien Ryckaert:
Thermal Considerations for Block-Level PPA Assessment in Angstrom Era: A Comparison Study of Nanosheet FETs (A10) & Complementary FETs (A5). VLSI Technology and Circuits 2024: 1-2 - 2023
- [c7]Melina Lofrano, Herman Oprins, Xinyue Chang, Bjorn Vermeersch, Olalla Varela Pedreira, Alicja Lesniewska, Vladimir Cherman, Ivan Ciofi, Kristof Croes, Seongho Park, Zsolt Tokei:
Towards accurate temperature prediction in BEOL for reliability assessment (Invited). IRPS 2023: 1-7 - [c6]Subrat Mishra, Sankatali Venkateswarlu, Bjorn Vermeersch, Moritz Brunion, Melina Lofrano, Dawit Burusie Abdi, Herman Oprins, Dwaipayan Biswas, Odysseas Zografos, Gaspard Hiblot, Geert Van der Plas, Pieter Weckx, Geert Hellings, James Myers, Francky Catthoor, Julien Ryckaert:
Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs). IRPS 2023: 1-7 - 2022
- [c5]Abhitosh Vais, Sachin Yadav, Yves Mols, Bjorn Vermeersch, Komal Vondkar Kodandarama, Marina Baryshnikova, G. Mannaert, R. Alcotte, Geert Boccardi, Piet Wambacq, Bertrand Parvais, R. Langer, Bernardette Kunert, Nadine Collaert:
III-V HBTs on 300 mm Si substrates using merged nano-ridges and its application in the study of impact of defects on DC and RF performance. ESSDERC 2022: 261-264 - [c4]AliReza Alian, Raúl Rodríguez, Sachin Yadav, Uthayasankaran Peralagu, Arturo Sibaja Hernandez, Vamsi Putcha, Ming Zhao, Rana ElKashlan, Bjorn Vermeersch, Hao Yu, Erik Bury, Ahmad Khaled, Nadine Collaert, Bertrand Parvais:
Impact of channel thickness scaling on the performance of GaN-on-Si RF HEMTs on highly C-doped GaN buffer. ESSDERC 2022: 384-387 - [c3]Bjorn Vermeersch, Erik Bury, Yang Xiang, Pieter Schuddinck, Krishna K. Bhuwalka, Geert Hellings, Julien Ryckaert:
Self-Heating in iN8-iN2 CMOS Logic Cells: Thermal Impact of Architecture (FinFET, Nanosheet, Forksheet and CFET) and Scaling Boosters. VLSI Technology and Circuits 2022: 371-372 - 2021
- [c2]Amita Rawat, Krishna K. Bhuwalka, Philippe Matagne, Bjorn Vermeersch, Hao Wu, Geert Hellings, Julien Ryckaert, Changze Liu:
Performance Trade-Off Scenarios for GAA Nanosheet FETs Considering Inner-spacers and Epi-induced Stress: Understanding & Mitigating Process Risks. ESSCIRC 2021: 55-58 - [c1]Amita Rawat, Krishna K. Bhuwalka, Philippe Matagne, Bjorn Vermeersch, Hao Wu, Geert Hellings, Julien Ryckaert, Changze Liu:
Performance Trade-Off Scenarios for GAA Nanosheet FETs Considering Inner-spacers and Epi-induced Stress: Understanding & Mitigating Process Risks. ESSDERC 2021: 55-58
Coauthor Index
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