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ORCIDGolta Khatibi
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2010 – 2019
- 2018
[j20]Golta Khatibi, A. Betzwar Kotas, Martin Lederer
:
Effect of aging on mechanical properties of high temperature Pb-rich solder joints. Microelectron. Reliab. 85: 1-11 (2018)- [j19]Thomas Walter, Golta Khatibi, Michael Nelhiebel, M. Stefenelli:
Characterization of cyclic delamination behavior of thin film multilayers. Microelectron. Reliab. 88-90: 721-725 (2018) - [j18]Bernhard Czerny, Golta Khatibi:
Cyclic robustness of heavy wire bonds: Al, AlMg, Cu and CucorAl. Microelectron. Reliab. 88-90: 745-751 (2018) - 2017
- [j17]Alice Lassnig, Martin Lederer, Golta Khatibi, Rainer Pelzer, W. Robl, Michael Nelhiebel:
High cycle fatigue testing of thermosonic ball bonds. Microelectron. Reliab. 71: 91-98 (2017) - [j16]Ali Mazloum-Nejadari, Golta Khatibi, Bernhard Czerny, Martin Lederer, Johann Nicolics, L. Weiss:
Reliability of Cu wire bonds in microelectronic packages. Microelectron. Reliab. 74: 147-154 (2017) - [j15]A. Betzwar Kotas, Golta Khatibi:
Isothermal bending fatigue response of solder joints in high power semiconductor test structures. Microelectron. Reliab. 76-77: 357-361 (2017) - [j14]Kristian Bonderup Pedersen, Dennis A. Nielsen, Bernhard Czerny, Golta Khatibi, Francesco Iannuzzo, Vladimir N. Popok, Kjeld Pedersen:
Wire bond degradation under thermo- and pure mechanical loading. Microelectron. Reliab. 76-77: 373-377 (2017) - 2016
- [j13]Bernhard Czerny, Golta Khatibi:
Interface reliability and lifetime prediction of heavy aluminum wire bonds. Microelectron. Reliab. 58: 65-72 (2016) - [j12]Bernhard Czerny, Ali Mazloum-Nejadari, Golta Khatibi, Laurens Weiss, Michael Zehetbauer:
Fatigue testing method for fine bond wires in an LQFP package. Microelectron. Reliab. 64: 270-275 (2016) - [j11]Thomas Walter, Martin Lederer, Golta Khatibi:
Delamination of polyimide/Cu films under mixed mode loading. Microelectron. Reliab. 64: 281-286 (2016) - 2015
- [c1]Ephraim Suhir, A. Bensoussan, Golta Khatibi, Johann Nicolics:
Probabilistic design for reliability in electronics and photonics: Role, significance, attributes, challenges. IRPS 2015: 5 - 2014
- [j10]Julien Magnien, Golta Khatibi:
Assessment of mechanical reliability of surface mounted capacitor by an accelerated shear fatigue test technique. Microelectron. Reliab. 54(9-10): 1764-1769 (2014) - [j9]Peyman Rafiee, Golta Khatibi:
A fast reliability assessment method for Si MEMS based microcantilever beams. Microelectron. Reliab. 54(9-10): 2180-2184 (2014) - 2013
- [j8]Bernhard Czerny, I. Paul, Golta Khatibi, Markus Thoben:
Experimental and analytical study of geometry effects on the fatigue life of Al bond wire interconnects. Microelectron. Reliab. 53(9-11): 1558-1562 (2013) - [j7]Peyman Rafiee, Golta Khatibi, N. Nelhiebel, Rainer Pelzer:
Application of quantitative modal analysis for investigation of thermal degradation of microelectronic packages. Microelectron. Reliab. 53(9-11): 1563-1567 (2013) - 2012
- [j6]Rainer Pelzer, Michael Nelhiebel, Robert Zink, Stefan Wöhlert, Alice Lassnig, Golta Khatibi:
High temperature storage reliability investigation of the Al-Cu wire bond interface. Microelectron. Reliab. 52(9-10): 1966-1970 (2012) - [j5]Bernhard Czerny, Martin Lederer, Bernhard Nagl, Alexander Trnka, Golta Khatibi, Markus Thoben:
Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions. Microelectron. Reliab. 52(9-10): 2353-2357 (2012) - 2010
- [j4]Bernhard Czerny, Golta Khatibi, Brigitte Weiss, T. Licht:
A fast test technique for life time estimation of ultrasonically welded Cu-Cu interconnects. Microelectron. Reliab. 50(9-11): 1641-1644 (2010)
2000 – 2009
- 2009
- [j3]Golta Khatibi, W. Wroczewski, Brigitte Weiss, H. Ipser:
A novel accelerated test technique for assessment of mechanical reliability of solder interconnects. Microelectron. Reliab. 49(9-11): 1283-1287 (2009) - 2008
- [j2]Golta Khatibi, W. Wroczewski, Brigitte Weiss, T. Licht:
A fast mechanical test technique for life time estimation of micro-joints. Microelectron. Reliab. 48(11-12): 1822-1830 (2008) - 2003
- [j1]Guy Lefranc, Brigitte Weiss, Christof Klos, J. Dick, Golta Khatibi, H. Berg:
Aluminum bond-wire properties after 1 billion mechanical cycles. Microelectron. Reliab. 43(9-11): 1833-1838 (2003)
Coauthor Index
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