"Thermo-mechanical analysis of bonding wires in IGBT modules under ..."

Bernhard Czerny et al. (2012)

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DOI: 10.1016/J.MICROREL.2012.06.081

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type: Journal Article

metadata version: 2022-10-02

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Bernhard Czerny, Martin Lederer, Bernhard Nagl, Alexander Trnka, Golta Khatibi, Markus Thoben:
Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions. Microelectron. Reliab. 52(9-10): 2353-2357 (2012)

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