"Fatigue testing method for fine bond wires in an LQFP package."

Bernhard Czerny et al. (2016)

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DOI: 10.1016/J.MICROREL.2016.07.068

access: closed

type: Journal Article

metadata version: 2022-03-23

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Bernhard Czerny, Ali Mazloum-Nejadari, Golta Khatibi, Laurens Weiss, Michael Zehetbauer:
Fatigue testing method for fine bond wires in an LQFP package. Microelectron. Reliab. 64: 270-275 (2016)

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