"High temperature storage reliability investigation of the Al-Cu wire bond ..."

Rainer Pelzer et al. (2012)

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DOI: 10.1016/J.MICROREL.2012.06.070

access: closed

type: Journal Article

metadata version: 2022-02-04

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Rainer Pelzer, Michael Nelhiebel, Robert Zink, Stefan Wöhlert, Alice Lassnig, Golta Khatibi:
High temperature storage reliability investigation of the Al-Cu wire bond interface. Microelectron. Reliab. 52(9-10): 1966-1970 (2012)

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