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"Reliability of Cu wire bonds in microelectronic packages."
Ali Mazloum-Nejadari et al. (2017)
- Ali Mazloum-Nejadari, Golta Khatibi, Bernhard Czerny, Martin Lederer, Johann Nicolics, L. Weiss:
Reliability of Cu wire bonds in microelectronic packages. Microelectron. Reliab. 74: 147-154 (2017)
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