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ORCIDIBM Journal of Research and Development, Volume 37, 1993
Volume 37, Number 1, 1993
- Hiroyuki Ono:
Architecture and performance of the ESPER-2 hard-disk drive servo writer. 3-11 - James E. Phillips, Stamatis Vassiliadis:
Proof of correctness of high-performance 3-1 interlock collapsing ALUs. 12-21 - Alina Deutsch, David W. Dranchak, G. Arjavalingam, Christopher W. Surovic, James K. Tam, Gerard V. Kopcsay, John B. Gillett:
Electrical characterization and performance limits of a flexible cable. 22-38
Volume 37, Number 2, 1993
- Jean Horkans:
Preface. 83-84 - Hariklia Deligianni, Lubomyr T. Romankiw:
In situ surface pH measurement during electrolysis using a rotating pH electrode. 85-96 - Jean Horkans, I-Chia Hsu Chang, Panayotis C. Andricacos:
A rotating ring-disk stripping technique used to study electroplating of Sn-Pb from methane sulfonic acid solutions. 97-106 - John G. Gaudiello, Gerald L. Ballard:
Mechanistic insights into metal-mediated electroless copper plating employing hypophosphite as a reducing agent. 107-116 - Rangarajan Jagannathan, Mahadevaiyer Krishnan:
Electroless plating of copper at a low pH level. 117-124 - John O. Dukovic:
Feature-scale simulation of resist-patterned electrodeposition. 125-142 - Oscar A. Moreno, Robert H. Katyl, Jeffrey D. Jones, Peter A. Moschak:
Mass transfer of an impinging jet confined between parallel plates. 143-156 - Kay Keij Kanazawa, Owen R. Melroy:
The quartz resonator: Electrochemical applications. 157-172 - Vlasta Brusic, Gerald S. Frankel, Chao-Kyn Hu, Miro M. Plechaty, Geraldine Cogin Schwartz:
Corrosion and protection of thin-line conductors in VLSI structures. 173-190 - Alejandro G. Schrott, Gerald S. Frankel:
Application of X-ray spectroscopy to the study of electrochemically formed surface oxide films. 191-206 - Madhav Datta:
Anodic dissolution of metals at high rates. 207-226 - Hajime Seki:
In situ infrared spectroscopy of the electrode - electrolyte interface. 227-242 - James R. White:
Conduction mechanisms in contaminant layers on printed circuit boards. 243-248 - Arthur F. Diaz, Jean Guay:
Contact charging of organic materials: Ion vs. electron transfer. 249-260
Volume 37, Number 3, 1993
- John M. Warlaumont:
Preface. 288-290 - Eberhard Spiller:
Early history of X-ray lithography at IBM. 291-298 - Alan D. Wilson:
X-ray lithography in IBM, 1980-1992, the development years. 299-318 - Henry I. Smith, Mark L. Schattenburg:
X-ray lithography from 500 to 30 nm: X-ray nanolithography. 319-330 - Jerry Z. Y. Guo, Franco Cerrina:
Modeling X-ray proximity lithography. 331-350 - Martin N. Wilson, Ailstair I. C. Smith, V. C. Kempson, Martin C. Townsend, Joseph C. Schouten, Robert J. Anderson, A. R. Jorden, Victor P. Suller, Michael W. Poole:
The Helios 1 compact superconducting storage ring X-ray source. 351-372 - Chas Archie:
Performance of the IBM synchrotron X-ray source for lithography. 373-384 - Jeffrey A. Leavey, L. Grant Lesoine:
Design considerations for the IBM X-ray lithography facility. 385-394 - Jerome P. Silverman, Robert P. Rippstein, James M. Oberschmidt:
X-ray lithography beamlines in the IBM Advanced Lithography Facility. 395-410 - Timothy R. Groves, John G. Hartley, Hans C. Pfeiffer, Denise Puisto, Donald K. Bailey:
Electron beam lithography tool for manufacture of X-ray masks. 411-420 - Patricia G. Blauner, John Mauer:
X-ray mask repair. 421-434 - David Seeger:
Resist materials and processes for X-ray lithography. 435-448
Volume 37, Number 4, 1993
- Dennis P. Fazzio, Michael A. Moser, Christopher J. Polson, John N. Scheffel:
Head actuator dynamics of an IBM 5 1/4-inch disk drive. 479-490 - Brock E. Osborn:
Statistical modeling in manufacturing: Adapting a diagnostic tool to real-time applications. 491-506 - Beth Tibbitts:
Flexible simulation of a complex semiconductor manufacturing line using a rule-based system. 507-522 - Stephen J. Grotzinger, Rarnesh Srinivasan, Ramakrishna Akella, Srinivas Bollapragada:
Component procurement and allocation for products assembled to forecast: Risk-pooling effects. 523-536 - David R. Irvin:
Modeling the cost of data communication for multi-node computer networks operating in the United States. 537-546 - Richard J. Eickemeyer, Stamatis Vassiliadis:
A load-instruction unit for pipelined processors. 547-564
Volume 37, Number 5, 1993
- Chun K. Lim, Thomas Caulfield, Joseph Benenati:
Preface. 582-584 - John S. Corbin:
Finite element analysis for Solder Ball Connect (SBC) structural design optimization. 585-596 - Michael D. Ries, Donald R. Banks, David P. Watson, Karl G. Hoebener:
Attachment of Solder Ball Connect (SBC) packages to circuit cards. 597-608 - H. Victor Mahaney:
Thermal modeling of the infrared reflow process for Solder Ball Connect (SBC). 609-620 - Tien Y. Wu, Yifan Guo, William T. Chen:
Thermal-mechanical strain characterization for printed wiring boards. 621-634 - Yifan Guo, Chun K. Lim, William T. Chen, Charles G. Woychik:
Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation. 635-648 - Hyung-Chu Choi, Yifan Guo, William LaFontaine, Chun K. Lim:
Solder Ball Connect (SBC) assemblies under thermal loading: II. Strain analysis via image processing, and reliability considerations. 649-660
Volume 37, Number 6, 1993
- Peter S. Hauge:
Preface. 678
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