"Thermal-mechanical strain characterization for printed wiring boards."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Tien Y. Wu, Yifan Guo, William T. Chen (1993)

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DOI: 10.1147/RD.375.0621

access: closed

type: Journal Article

metadata version: 2020-03-13

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Tien Y. Wu, Yifan Guo, William T. Chen:
Thermal-mechanical strain characterization for printed wiring boards. IBM J. Res. Dev. 37(5): 621-634 (1993)

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