"Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation ..."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Yifan Guo et al. (1993)

> Home

Details and statistics

DOI: 10.1147/RD.375.0635

access: closed

type: Journal Article

metadata version: 2020-03-13

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/ibmrd/GuoLCW93
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/ibmrd/GuoLCW93
Yifan Guo, Chun K. Lim, William T. Chen, Charles G. Woychik:
Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation. IBM J. Res. Dev. 37(5): 635-648 (1993)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.