"Solder Ball Connect (SBC) assemblies under thermal loading: II. Strain ..."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Hyung-Chu Choi et al. (1993)

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DOI: 10.1147/RD.375.0649

access: closed

type: Journal Article

metadata version: 2020-03-13

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Hyung-Chu Choi, Yifan Guo, William LaFontaine, Chun K. Lim:
Solder Ball Connect (SBC) assemblies under thermal loading: II. Strain analysis via image processing, and reliability considerations. IBM J. Res. Dev. 37(5): 649-660 (1993)

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